Olivér Krammer

According to our database, Olivér Krammer authored at least 11 papers between 2009 and 2024.

Collaborative distances:

• Dijkstra number of four.
• Erdős number of four.

2024

Assessing Temperature Sensitivity and Ring Oscillator Count Impact on Configurable Ring Oscillator PUF Performance.

Husam Kareem, Olivér Krammer, Dmitriy Dunaev

Proceedings of the 13th Mediterranean Conference on Embedded Computing, 2024

2023

Can ChatGPT Help in Electronics Research and Development? A Case Study with Applied Sensors.

Zoltán Tafferner, Balázs Illés, Olivér Krammer, Attila Géczy

Sensors, 2023

2022

Analyzing the Overfitting of Boosted Decision Trees for the Modelling of Stencil Printing.

Péter Martinek, Olivér Krammer

Period. Polytech. Electr. Eng. Comput. Sci., 2022

2019

Analysing machine learning techniques for predicting the hole-filling in pin-in-paste technology.

Péter Martinek, Olivér Krammer

Comput. Ind. Eng., 2019

2018

Microelectronics education in Europe in 21^st century.

Slavka Tzanova, Attila Géczy, Olivér Krammer, Péter Martinek, Zholt Lyefalvi-Vitez, Mile Stankovski, Rosario Gil, Manuel Castro Gil, Norocel Codreanu

Proceedings of the 2018 IEEE Global Engineering Education Conference, 2018

2017

Automatic characterisation method for statistical evaluation of tin whisker growth.

Olivér Krammer, Balázs Illés, Réka Bátorfi, Karel Dusek

Microelectron. Reliab., 2017

2014

Modelling the self-alignment of passive chip components during reflow soldering.

Olivér Krammer

Microelectron. Reliab., 2014

2013

Solder Paste Scooping Detection by Multilevel Visual Inspection of Printed Circuit Boards.

Csaba Benedek, Olivér Krammer, Mihály Janoczki, László Jakab

IEEE Trans. Ind. Electron., 2013

2012

Modelling the effect of uneven PWB surface on stencil bending during stencil printing process.

Olivér Krammer, László Milán Molnár, László Jakab, András Szabó

Microelectron. Reliab., 2012

2010

Improved method for determining the shear strength of chip component solder joints.

Olivér Krammer, Bálint Sinkovics

Microelectron. Reliab., 2010

2009

Board level investigation of BGA solder joint deformation strength.

Bálint Sinkovics, Olivér Krammer

Microelectron. Reliab., 2009