Olaf Wittler

According to our database, Olaf Wittler authored at least 8 papers between 2011 and 2017.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of five.

2017

Laser cuts increase the reliability of heavy-wire bonds and enable on-line process control using thermography.

A. Middendorf, A. Grams, S. Janzen, Klaus-Dieter Lang, Olaf Wittler

Microelectron. Reliab., 2017

2015

Correlation between mechanical properties and microstructure of different aluminum wire qualities after ultrasonic bonding.

Marian Sebastian Broll, Ute Geissler, Jan Höfer, Stefan Schmitz, Olaf Wittler, Martin Schneider-Ramelow, Klaus-Dieter Lang

Microelectron. Reliab., 2015

Microstructural evolution of ultrasonic-bonded aluminum wires.

Marian Sebastian Broll, Ute Geissler, Jan Höfer, Stefan Schmitz, Olaf Wittler, Klaus-Dieter Lang

Microelectron. Reliab., 2015

2014

Improving the FE simulation of molded packages using warpage measurements.

Saskia Huber, Marius van Dijk, Hans Walter, Olaf Wittler, Tina Thomas, Klaus-Dieter Lang

Microelectron. Reliab., 2014

2013

Transport of moisture at epoxy-SiO₂ interfaces investigated by molecular modeling.

O. Hölck, Jörg Bauer, Tanja Braun, Hans Walter, Olaf Wittler, Bernhard Wunderle, Klaus-Dieter Lang

Microelectron. Reliab., 2013

2012

Degradation of moulding compounds during highly accelerated stress tests - A simple approach to study adhesion by performing button shear tests.

Reinhard Pufall, Michael Goroll, Joachim Mahler, Werner Kanert, M. Bouazza, Olaf Wittler, Rainer Dudek

Microelectron. Reliab., 2012

Comparative characterization of chip to epoxy interfaces by molecular modeling and contact angle determination.

O. Hölck, Jörg Bauer, Olaf Wittler, Bernd Michel, Bernhard Wunderle

Microelectron. Reliab., 2012

2011

Extraction of elastic-plastic material properties of thin films through nanoindentaion technique with support of numerical methods.

Lukasz Dowhan, Artur Wymyslowski, Pawel Janus, Magdalena Ekwinska, Olaf Wittler

Microelectron. Reliab., 2011