O. Hölck

According to our database, O. Hölck authored at least 4 papers between 2010 and 2013.

Collaborative distances:

• Dijkstra number of six.
• Erdős number of five.

2013

Transport of moisture at epoxy-SiO₂ interfaces investigated by molecular modeling.

O. Hölck, Jörg Bauer, Tanja Braun, Hans Walter, Olaf Wittler, Bernhard Wunderle, Klaus-Dieter Lang

Microelectron. Reliab., 2013

2012

Comparative characterization of chip to epoxy interfaces by molecular modeling and contact angle determination.

O. Hölck, Jörg Bauer, Olaf Wittler, Bernd Michel, Bernhard Wunderle

Microelectron. Reliab., 2012

2011

Basic thermo-mechanical property estimation of a 3D-crosslinked epoxy/SiO₂ interface using molecular modelling.

O. Hölck, E. Dermitzaki, Bernhard Wunderle, Jörg Bauer, Bernd Michel

Microelectron. Reliab., 2011

2010

Molecular dynamics approach to structure-property correlation in epoxy resins for thermo-mechanical lifetime modeling.

Bernhard Wunderle, E. Dermitzaki, O. Hölck, Jörg Bauer, Hans Walter, Q. Shaik, K. Rätzke, Franz Faupel, Bernd Michel, Herbert Reichl

Microelectron. Reliab., 2010