O. Bochow-Neß

According to our database, O. Bochow-Neß authored at least 1 paper in 2014.

Collaborative distances:

• Dijkstra number of six.
• Erdős number of five.

2014

On the crack and delamination risk optimization of a Si-interposer for LED packaging.

Jürgen Auersperg, Rainer Dudek, R. Jordan, O. Bochow-Neß, Sven Rzepka, Bernd Michel

Microelectron. Reliab., 2014