Norman Y. Zhou

According to our database, Norman Y. Zhou authored at least 14 papers between 2007 and 2022.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2022

A Novel 2T2R CR-based TCAM Design for High-speed and Energy-efficient Applications.

Kangqiang Pan, Amr M. S. Tosson, Ningxuan Wang, Norman Y. Zhou, Lan Wei

Proceedings of the GLSVLSI '22: Great Lakes Symposium on VLSI 2022, Irvine CA USA, June 6, 2022

2021

A Novel Programmable Variation-Tolerant RRAM-based Delay Element Circuit.

Kangqiang Pan, Amr M. S. Tosson, Norman Y. Zhou, Lan Wei

Proceedings of the IEEE/ACM International Symposium on Nanoscale Architectures, 2021

2019

Batteryless Wireless Water Leak Detection System.

Oliver Witham, Levi Nathan Johnston, Ming Xiao, Jiayun Feng, Norman Y. Zhou, George Shaker

Proceedings of the International Conference on Smart Applications, 2019

2013

Role of impact ultrasound on bond strength and Al pad splash in Cu wire bonding.

Alireza Rezvani, Aashish Shah, M. Mayer, Norman Y. Zhou, J. T. Moon

Microelectron. Reliab., 2013

2012

Effect of EFO parameters and superimposed ultrasound on work hardening behavior of palladium coated copper wire in thermosonic ball bonding.

Wan Ho Song, Michael Mayer, Norman Y. Zhou, S. H. Kim, J. S. Hwang, J. T. Moon

Microelectron. Reliab., 2012

2011

Reduction of ultrasonic pad stress and aluminum splash in copper ball bonding.

Aashish Shah, Alireza Rezvani, M. Mayer, Norman Y. Zhou, John Persic, J. T. Moon

Microelectron. Reliab., 2011

Role of process parameters on bondability and pad damage indicators in copper ball bonding.

I. Qin, Aashish Shah, C. Huynh, M. Meyer, M. Mayer, Norman Y. Zhou

Microelectron. Reliab., 2011

Effect of gas type and flow rate on Cu free air ball formation in thermosonic wire bonding.

A. Pequegnat, H. J. Kim, M. Mayer, Norman Y. Zhou, John Persic, J. T. Moon

Microelectron. Reliab., 2011

Influence of gold pick up on the hardness of copper free air ball.

Jae-sik Lee, Michael Mayer, Norman Y. Zhou, J. T. Moon, John Persic

Microelectron. Reliab., 2011

Silver pick up during tail formation in thermosonic wire bonding process.

Jae-sik Lee, Michael Mayer, Norman Y. Zhou, S. J. Hong, J. T. Moon

Microelectron. Reliab., 2011

2008

Characteristics of Sn8Zn3Bi solder joints and crack resistance with various PCB and lead coatings.

Young Woo Lee, Ki Ju Lee, Norman Y. Zhou, Jae Pil Jung

Microelectron. Reliab., 2008

Growth behavior of Cu/Al intermetallic compounds and cracks in copper ball bonds during isothermal aging.

Chunjing Hang, Chunqing Wang, M. Mayer, Yanhong Tian, Norman Y. Zhou, Honghui Wang

Microelectron. Reliab., 2008

Erratum to "Iterative optimization of tail breaking force of 1 mil wire thermosonic ball bonding processes and the influence of plasma cleaning": [Microelectronics Journal 38 (2007) 842-847].

Jae-sik Lee, Michael Mayer, Norman Y. Zhou, S. J. Hong

Microelectron. J., 2008

2007

Iterative optimization of tail breaking force of 1mil wire thermosonic ball bonding processes and the influence of plasma cleaning.

Jae-sik Lee, Michael Mayer, Norman Y. Zhou, S. J. Hong

Microelectron. J., 2007