Noriyuki Miyazaki

According to our database, Noriyuki Miyazaki authored at least 3 papers between 2008 and 2013.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2013

Non-linear analyses of strain in flip chip packages improved by the measurement using the digital image correlation method.

Toru Ikeda, Toshifumi Kanno, Nobuyuki Shishido, Noriyuki Miyazaki, Hiroyuki Tanaka, Takuya Hatao

Microelectron. Reliab., 2013

2011

Combination between the nonlinear finite element analyses and the strain measurement using the digital image correlation for a new 3D SIC package.

Toru Ikeda, Masatoshi Oka, Shinya Kawahara, Noriyuki Miyazaki, Keiji Matsumoto, Sayuri Kohara, Yasumitsu Orii, Fumiaki Yamada, Morihiro Kada

Proceedings of the 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31, 2011

2008

Residual stress evaluation in resin-molded IC chips using finite element analysis and piezoresistive gauges.

Masaaki Koganemaru, Toru Ikeda, Noriyuki Miyazaki

Microelectron. Reliab., 2008