Nobuyuki Shishido

According to our database, Nobuyuki Shishido authored at least 3 papers between 2013 and 2015.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2015

Scenario for catastrophic failure in interconnect structures under chip package interaction.

Masaki Omiya, Shoji Kamiya, Nobuyuki Shishido, Kozo Koiwa, Hisashi Sato, Masahiro Nishida, Takashi Suzuki, Tomoji Nakamura, Toshiaki Suzuki, Takeshi Nokuo

Proceedings of the IEEE International Reliability Physics Symposium, 2015

2013

Experimental and numerical evaluation of interfacial adhesion on Cu/SiN in LSI interconnect structures.

Masaki Omiya, Kozo Koiwa, Nobuyuki Shishido, Shoji Kamiya, Chuantong Chen, Hisashi Sato, Masahiro Nishida, Takashi Suzuki, Tomoji Nakamura, Toshiaki Suzuki, Takeshi Nokuo

Microelectron. Reliab., 2013

Non-linear analyses of strain in flip chip packages improved by the measurement using the digital image correlation method.

Toru Ikeda, Toshifumi Kanno, Nobuyuki Shishido, Noriyuki Miyazaki, Hiroyuki Tanaka, Takuya Hatao

Microelectron. Reliab., 2013