Ningmei Yu
Orcid: 0000-0002-4219-8364
According to our database1,
Ningmei Yu
authored at least 55 papers
between 2014 and 2024.
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Collaborative distances:
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Bibliography
2024
A Low-Latency Power Series Approximate Computing and Architecture for Co-Calculation of Division and Square Root.
IEEE Trans. Circuits Syst. I Regul. Pap., June, 2024
Synchronous Driving Method for Stitching Pixel Arrays Based on an Adaptive Correction Technique.
Sensors, March, 2024
Microelectron. J., February, 2024
IEICE Electron. Express, 2024
A Hardware Architecture for Frequency-Domain Image Processing Based on Split-Radix 2-4 FFT.
Proceedings of the 39th Conference on Design of Circuits and Integrated Systems, 2024
Proceedings of the International Conference on Cyber-Enabled Distributed Computing and Knowledge Discovery, 2024
2023
Sensors, November, 2023
Sensors, January, 2023
High-Linearity and High-Speed ROIC of Ultra-Large Array Infrared Detectors Based on Adaptive Compensation and Enhancement.
Sensors, 2023
Miniaturized silicon-based substrate integrated waveguide filter for 6G applications.
Microelectron. J., 2023
Research on Dual-Line Array Subpixel Scanning Imaging for IoMT-Based Blood Cell Analysis System.
IEEE Internet Things J., 2023
Integr., 2023
TSV-based SIW bandpass filter with adjustable transmission zeros for D-band applications.
IEICE Electron. Express, 2023
2022
A Miniaturized Wideband Interdigital Bandpass Filter With High Out-Band Suppression Based on TSV Technology for W-Band Application.
IEEE Trans. Very Large Scale Integr. Syst., 2022
A 56-Gb/s Reconfigurable Silicon-Photonics Transmitter Using High-Swing Distributed Driver and 2-Tap In-Segment Feed-Forward Equalizer in 65-nm CMOS.
IEEE Trans. Circuits Syst. I Regul. Pap., 2022
Design of a PAM-4 VCSEL-Based Transceiver Front-End for Beyond-400G Short-Reach Optical Interconnects.
IEEE Trans. Circuits Syst. I Regul. Pap., 2022
Microelectron. J., 2022
A self-compensated approach for ramp kickback noise in CMOS image sensor column parallel single slope ADC.
Microelectron. J., 2022
A miniature TSV-based branch line coupler using π equivalent circuit model for transmission line.
IEICE Electron. Express, 2022
IEICE Electron. Express, 2022
A wireless multi-channel low-cost lab-on-chip algae culture monitor AIoT system for algae farm.
Comput. Electron. Agric., 2022
2021
Design of 0-15 GHz flat-bandwidth programmable gain amplifier based on transconductance switching technique.
Microelectron. J., 2021
Integr., 2021
IEICE Electron. Express, 2021
Proceedings of the IEEE Asia Pacific Conference on Circuit and Systems, 2021
2020
Dynamic equalization and fast settling based wide operating voltage range 93 dB PSRR PTAT current reference.
Microelectron. J., 2020
IEICE Trans. Inf. Syst., 2020
IEICE Trans. Fundam. Electron. Commun. Comput. Sci., 2020
Which Metric Is Suitable for Evaluating Your Multi-Threading Processors? In Terms of Throughput, Fairness, and Predictability.
IEICE Trans. Fundam. Electron. Commun. Comput. Sci., 2020
An improved segmented DAC for column readout circuit correction of large array CMOS image sensor.
IEICE Electron. Express, 2020
A synchronous driving approach based on adaptive delay phase-locked loop for stitching CMOS image sensor.
IEICE Electron. Express, 2020
Methodology of Noise Flatness Based on Network Quality Factor in RF Wideband Applications.
Circuits Syst. Signal Process., 2020
IEEE Access, 2020
Proceedings of the 2020 IEEE International Conference on Integrated Circuits, 2020
A 28GBaud High-Swing Linear Mach-Zehnder Modulators Driver for PAM-4 and Coherent Optical Communications.
Proceedings of the 2020 IEEE International Conference on Integrated Circuits, 2020
2019
A Quantized CNN-Based Microfluidic Lensless-Sensing Mobile Blood-Acquisition and Analysis System.
Sensors, 2019
IEICE Trans. Inf. Syst., 2019
IEICE Electron. Express, 2019
QoSMT: supporting precise performance control for simultaneous multithreading architecture.
Proceedings of the ACM International Conference on Supercomputing, 2019
2018
Statically triggered 3×VDD-Tolerant ESD detection circuit in a 90-nm low-voltage CMOS process.
Microelectron. J., 2018
Q-Learning-Based Voltage-Swing Tuning and Compensation for 2.5-D Memory-Logic Integration.
IEEE Des. Test, 2018
Classification of White Blood Cells by Convolution Neural Network in Lens-Free Imaging System.
Proceedings of the 11th International Congress on Image and Signal Processing, 2018
Nonlinear CMOS Image Sensor with SOC Integrated Local Contrast Stretch for Bio-Microfluidic Imaging.
Proceedings of the 18th IEEE International Conference on Bioinformatics and Bioengineering, 2018
Study on the Channel Characteristics of Auxiliary Medical Devices Based on MDAPSK Technology.
Proceedings of the 18th IEEE International Conference on Bioinformatics and Bioengineering, 2018
2017
IEEE Trans. Very Large Scale Integr. Syst., 2017
IEICE Electron. Express, 2017
2016
IEICE Electron. Express, 2016
Thermal management of coaxial through-silicon-via (C-TSV)-based three-dimensional integrated circuit (3D IC).
IEICE Electron. Express, 2016
2015
Effects of coaxial through-silicon via on carrier mobility along [100] and [110] crystal directions of (100) silicon.
IEICE Electron. Express, 2015
Study on thermal stress and keep-out zone induced by Cu and SiO<sub>2</sub> filled coaxial-annular through-silicon via.
IEICE Electron. Express, 2015
IEEE Des. Test, 2015
2014
An energy-efficient 2.5D through-silicon interposer I/O with self-adaptive adjustment of output-voltage swing.
Proceedings of the International Symposium on Low Power Electronics and Design, 2014