Nicolas Bresson

According to our database, Nicolas Bresson authored at least 5 papers between 2016 and 2021.

Collaborative distances:

• Dijkstra number of four.
• Erdős number of four.

2021

3D interconnection using copper direct hybrid bonding for GaN on silicon wafer.

Christophe Dubarry, Lucile Arnaud, Maria-Luisa Calvo-Muñoz, Gaëlle Mauguen, Stéphane Moreau, R. Crochemore, Nicolas Bresson, Bernard Aventurier

Proceedings of the IEEE International 3D Systems Integration Conference, 2021

2019

Die to Wafer Direct Hybid Bonding Demonstration with High Alignment Accuracy and Electrical Yields.

Amadine Jouve, Loïc Sanchez, Clément Castan, Nicolas Bresson, Frank Fournel, Nicolas Raynaud, Pascal Metzger

Proceedings of the 2019 International 3D Systems Integration Conference (3DIC), 2019

Towards a Complete Direct Hybrid Bonding D2W Integration Flow: Known-Good-Dies and Die Planarization Modules Development.

Emilie Bourjot, Paul Stewart, Christophe Dubarry, E. Lagoutte, E. Rolland, Nicolas Bresson, G. Romano, D. Scevola, Viorel Balan, Jérôme Dechamp, Marc Zussy, Gaëlle Mauguen, Clément Castan, Loïc Sanchez, Amadine Jouve, Frank Fournel, Séverine Cheramy

Proceedings of the 2019 International 3D Systems Integration Conference (3DIC), 2019

2018

Fine pitch 3D interconnections with hybrid bonding technology: From process robustness to reliability.

Lucile Arnaud, Stéphane Moreau, Amadine Jouve, Imed Jani, Didier Lattard, F. Fournel, C. Euvrard, Y. Exbrayat, Viorel Balan, Nicolas Bresson, S. Lhostis, J. Jourdon, E. Deloffre, S. Guillaumet, Alexis Farcy, Simon Gousseau, M. Arnoux

Proceedings of the IEEE International Reliability Physics Symposium, 2018

2016

ITAC: A complete 3D integration test platform.

Didier Lattard, Lucile Arnaud, Arnaud Garnier, Nicolas Bresson, Franck Bana, R. Segaud, Amadine Jouve, H. Jacquinot, Stéphane Moreau, Karim Azizi-Mourier, C. Chantre, Pascal Vivet, Gaël Pillonnet, F. Casset, F. Ponthenier, Alexis Farcy, S. Lhostis, Jean Michailos, Alexandre Arriordaz, Séverine Cheramy

Proceedings of the 2016 IEEE International 3D Systems Integration Conference, 2016