Nick M. Ridler

Orcid: 0000-0002-1462-2914

According to our database1, Nick M. Ridler authored at least 24 papers between 2003 and 2024.

Collaborative distances:
  • Dijkstra number2 of four.
  • Erdős number3 of four.

Awards

IEEE Fellow

IEEE Fellow 2014, "For contributions to traceability in precision high-frequency electromagnetic measurements".

Timeline

Legend:

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PhD thesis 
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Links

On csauthors.net:

Bibliography

2024
Characterizing S-Parameters of Microwave Coaxial Devices With up to Four Ports at Temperatures of 3 K and Above for Quantum Computing Applications.
IEEE Trans. Instrum. Meas., 2024

Improvements to Millimeter-Wave Dielectric Measurement Using Material Characterization Kit (MCK).
IEEE Trans. Instrum. Meas., 2024

Characterisation of Power Transistors for Wireless Network Applications Using Passive and Active Load-Pull.
Proceedings of the 2024 IEEE International Symposium on Measurements & Networking (M&N), 2024

2023
3-D Printed THz Waveguide Components.
IEEE Access, 2023

Determination of the Permittivity of Transmission Lines at Milli-Kelvin Temperatures.
IEEE Access, 2023

Polymer-Based 3-D Printed 140 to 220 GHz Metal Waveguide Thru Lines, Twist and Filters.
IEEE Access, 2023

2022
Uncertainties in Small-Signal and Large-Signal Measurements of RF Amplifiers Using a VNA.
IEEE Instrum. Meas. Mag., 2022

3-D Printing Quantization Predistortion Applied to Sub-THz Chained-Function Filters.
IEEE Access, 2022

Characterizing Scattering Parameters of Superconducting Quantum Integrated Circuits at Milli-Kelvin Temperatures.
IEEE Access, 2022

3-D Printed Plug and Play Prototyping for Low-Cost Sub-THz Subsystems.
IEEE Access, 2022

2021
Assessing the Impact of Data Filtering Techniques on Material Characterization at Millimeter-Wave Frequencies.
IEEE Trans. Instrum. Meas., 2021

Polymer-Based 3-D Printed 140-220 GHz Low-Cost Quasi-Optical Components and Integrated Subsystem Assembly.
IEEE Access, 2021

Microwave Characterization of Conductive PLA and Its Application to a 12 to 18 GHz 3-D Printed Rotary Vane Attenuator.
IEEE Access, 2021

2020
Characterization of Dielectric Materials at WR-15 Band (50-75 GHz) Using VNA-Based Technique.
IEEE Trans. Instrum. Meas., 2020

Ultra-Wideband Terahertz Channel Propagation Measurements from 500 to 750 GHz.
Proceedings of the 2020 International Conference on UK-China Emerging Technologies, 2020

2019
Establishing a New Form of Primary Impedance Standard at Millimeter-Wave Frequencies.
IEEE Trans. Instrum. Meas., 2019

Microwave Characterization of Low-Loss FDM 3-D Printed ABS With Dielectric-Filled Metal-Pipe Rectangular Waveguide Spectroscopy.
IEEE Access, 2019

Polymer-Based 3-D Printed Ku-Band Steerable Phased-Array Antenna Subsystem.
IEEE Access, 2019

2017
Metrology State-of-the-Art and Challenges in Broadband Phase-Sensitive Terahertz Measurements.
Proc. IEEE, 2017

2011
Comparison Between NPL and NMIJ of Diameter and Scattering Parameter Measurements of Precision 1.85 mm Coaxial Air Lines.
IEEE Trans. Instrum. Meas., 2011

2009
Comparison Between Two National Metrology Institutes of Diameters and Characteristic Impedance of Coaxial Air Lines.
IEEE Trans. Instrum. Meas., 2009

2003
Generalized adaptive calibration schemes for precision RF vector network analyzer measurements.
IEEE Trans. Instrum. Meas., 2003

Traceability via the Internet for microwave measurements using vector network analyzers.
IEEE Trans. Instrum. Meas., 2003

An interpolation scheme for precision intermediate frequency reflection coefficient measurement.
IEEE Trans. Instrum. Meas., 2003


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