Neus Vidal

Orcid: 0000-0001-9445-7447

According to our database1, Neus Vidal authored at least 13 papers between 2014 and 2022.

Collaborative distances:
  • Dijkstra number2 of five.
  • Erdős number3 of five.

Timeline

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Bibliography

2022
Microstrip-Fed 3D-Printed H-Sectorial Horn Phased Array.
Sensors, 2022

Very compact 3D-printed folded branch-line hybrid coupler based on loaded helical-microstrip transmission lines.
Integr., 2022

3D-Printed Broadband Power Divider Based on Helical-Microstrip Transmission Line Segments.
IEEE Access, 2022

2020
3D-Printed UHF-RFID Tag for Embedded Applications.
IEEE Access, 2020

Design and Characterization of Non-planar 3D-printed Passive UHF-RFID Tag.
Proceedings of the XXXV Conference on Design of Circuits and Integrated Systems, 2020

Compact 3D-Printed Folded Branch-Line Hybrid Coupler based on Helical-Microstrip Transmission Lines.
Proceedings of the XXXV Conference on Design of Circuits and Integrated Systems, 2020

2019
Analysis and Optimization of Multi-Winding Toroidal Inductors for Use in Multilayered Technologies.
IEEE Access, 2019

3D Printed 5-Order Butterworth Passive Filter with Conical Inductors for RF Broadband Applications.
Proceedings of the XXXIV Conference on Design of Circuits and Integrated Systems, 2019

2018
Quasi-static PEEC planar solver using a weighted combination of 2D and 3D analytical Green's functions and a predictive meshing generator.
Integr., 2018

Fabrication of Full-3D Printed Electronics RF Passive Components and Circuits.
Proceedings of the 14th Conference on Ph.D. Research in Microelectronics and Electronics, 2018

2017
An Automated Design Methodology of RF Circuits by Using Pareto-Optimal Fronts of EM-Simulated Inductors.
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2017

Extending the frequency range of quasi-static electromagnetic solvers.
Proceedings of the 14th International Conference on Synthesis, 2017

2014
Automated Generation of the Optimal Performance Trade-Offs of Integrated Inductors.
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2014


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