N. Heylen

According to our database, N. Heylen authored at least 2 papers between 2018 and 2024.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2024

Backside Power Delivery with relaxed overlay for backside patterning using extreme wafer thinning and Molybdenum-filled slit nano Through Silicon Vias.

P. Zhao, Liesbeth Witters, Anne Jourdain, Michele Stucchi, Nicolas Jourdan, J. W. Maes, H. Bana, C. Zhu, R. Chukka, F. Sebaai, Kevin Vandersmissen, N. Heylen, D. Montero, S. Wang, K. D'Have, F. Schleicher, J. De Vos, Gerald Beyer, A. Miller, Eric Beyne

Proceedings of the IEEE Symposium on VLSI Technology and Circuits 2024, 2024

2018

Sequential 3D: Key integration challenges and opportunities for advanced semiconductor scaling.

A. Vandooren, Liesbeth Witters, Jacopo Franco, Arindam Mallik, Bertrand Parvais, Z. Wu, Amey Walke, V. Deshpande, E. Rosseel, Andriy Hikavyy, W. Li, L. Peng, Nouredine Rassoul, Geraldine Jamieson, Fumihiro Inoue, G. Verbinnen, Katia Devriendt, Lieve Teugels, N. Heylen, E. Vecchio, T. Zheng, Niamh Waldron, Vincent De Heyn, Dan Mocuta, Nadine Collaert

Proceedings of the 2018 International Conference on IC Design & Technology, 2018