N. H. Kao

According to our database, N. H. Kao authored at least 2 papers in 2006.

Collaborative distances:

• Dijkstra number of six.
• Erdős number of six.

2006

An investigation into the effects of probing and wire bonding stress on the reliability of BOAC.

K. M. Chen, B. C. Wu, K. H. Tang, F. Y. Cheng, N. H. Kao, J. Y. Lai

Microelectron. Reliab., 2006

Effects of underfill materials on the reliability of low-K flip-chip packaging.

K. M. Chen, D. S. Jiang, N. H. Kao, J. Y. Lai

Microelectron. Reliab., 2006