Muneeb Zia

According to our database, Muneeb Zia authored at least 6 papers between 2014 and 2022.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2022

High-performance Flexible Microelectrode Array with PEDOT: PSS Coated 3D Micro-cones for Electromyographic Recording.

Jiaao Lu, Muneeb Zia, Matthew J. Williams, Amanda L. Jacob, Bryce Chung, Samuel J. Sober, Muhannad S. Bakir

Proceedings of the 44th Annual International Conference of the IEEE Engineering in Medicine & Biology Society, 2022

2017

Microfabrication, assembly, and hermetic packaging of mm-sized free-floating neural probes.

Pyungwoo Yeon, Joe L. Gonzalez, Muneeb Zia, Sreejith Kochupurackal Rajan, Gary S. May, Muhannad S. Bakir, Maysam Ghovanloo

Proceedings of the IEEE Biomedical Circuits and Systems Conference, 2017

2016

Chip-to-chip interconnect integration technologies.

Muneeb Zia, Chaoqi Zhang, Hyun Suk Yang, Li Zheng, Muhannad S. Bakir

IEICE Electron. Express, 2016

2015

A Memory-Based Logic Block With Optimized-for-Read SRAM for Energy-Efficient Reconfigurable Computing Fabric.

Wen Yueh, Subho Chatterjee, Muneeb Zia, Swarup Bhunia, Saibal Mukhopadhyay

IEEE Trans. Circuits Syst. II Express Briefs, 2015

Fabrication of and cell growth on 'silicon membranes' with high density TSVs for bio-sensing applications.

Muneeb Zia, Chaoqi Zhang, Paragkumar Thadesar, Tracy Hookway, Taiyun Chi, Joe L. Gonzalez, Todd C. McDevitt, Hua Wang, Muhannad S. Bakir

Proceedings of the IEEE Biomedical Circuits and Systems Conference, 2015

2014

Au-NiW Mechanically Flexible Interconnects (MFIs) and TSV integration for 3D interconnects.

Chaoqi Zhang, Paragkumar Thadesar, Muneeb Zia, Thomas E. Sarvey, Muhannad S. Bakir

Proceedings of the 2014 International 3D Systems Integration Conference, 2014