Mudasir Ahmad
According to our database1,
Mudasir Ahmad
authored at least 2 papers
between 2013 and 2014.
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Bibliography
2014
Proceedings of the 25th IEEE International Symposium on Software Reliability Engineering Workshops, 2014
2013
Effect of pad surface finish and reflow cooling rate on the microstructure and the mechanical behavior of SnAgCu solder alloys.
Microelectron. Reliab., 2013