Mostafa Said

According to our database, Mostafa Said authored at least 12 papers between 2013 and 2021.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2021

Novel flexible buffering architectures for 3D-NoCs.

Mostafa Said, Amin Sarihi, Ahmad Patooghy, Awny M. El-Mohandes, Abdel-Hameed A. Badawy, Fayez Gebali

Sustain. Comput. Informatics Syst., 2021

A Survey on the Security of Wired, Wireless, and 3D Network-on-Chips.

Amin Sarihi, Ahmad Patooghy, Ahmed Khalid, Mahdi Hasanzadeh, Mostafa Said, Abdel-Hameed A. Badawy

IEEE Access, 2021

2020

LoCool: Fighting Hot Spots Locally for Improving System Energy Efficiency.

Fulya Kaplan, Mostafa Said, Sherief Reda, Ayse K. Coskun

IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2020

2019

Thermal-aware network-on-chips: Single- and cross-layered approaches.

Mostafa Said, Ahmed Shalaby, Fayez Gebali

Future Gener. Comput. Syst., 2019

2018

Understanding the Sources of Power Consumption in Mobile SoCs.

Mostafa Said, Sofiane Chetoui, Adel Belouchrani, Sherief Reda

Proceedings of the Ninth International Green and Sustainable Computing Conference, 2018

2017

A novel power reduction technique using wire multiplexing.

Mostafa Said, Hossam Hassan, HyungWon Kim, Mostafa Khamis

Proceedings of the 30th IEEE International System-on-Chip Conference, 2017

Work-in-Progress: A Flexible Router Architecture for 3D NoCs.

Mostafa Khamis, Mostafa Said, Ahmed Shalaby

Proceedings of the 2017 IEEE Real-Time Systems Symposium, 2017

2016

A design methodology and various performance and fabrication metrics evaluation of 3D Network-on-Chip with multiplexed Through-Silicon Vias.

Mostafa Said, Ahmed Shalaby, Farhad Mehdipour, Morteza Biglari-Abhari, Mohamed El-Sayed

Microprocess. Microsystems, 2016

Performance evaluation of buffer sharing routers for Network on Chip.

Hossam Hassan, Mostafa Said, HyungWon Kim

Proceedings of the IEEE 59th International Midwest Symposium on Circuits and Systems, 2016

2014

Keep-Out-Zone analysis for three-dimensional ICs.

Mostafa Said, Mohamed El-Sayed, Farhad Mehdipour, Nobuaki Miyakawa

Proceedings of the Technical Papers of 2014 International Symposium on VLSI Design, 2014

A Design Methodology for Performance Maintenance of 3D Network-on-Chip with Multiplexed Through-Silicon Vias.

Mostafa Said, Farhad Mehdipour, Kazuaki J. Murakami, Mohamed El-Sayed

Proceedings of the 3rd International Workshop on Many-core Embedded Systems (MES'2015) held on June 13, 2014

2013

Improving Performance and Fabrication Metrics of Three-Dimensional ICs by Multiplexing Through-Silicon Vias.

Mostafa Said, Farhad Mehdipour, Mohamed El-Sayed

Proceedings of the 2013 Euromicro Conference on Digital System Design, 2013