Monil Shah

According to our database, Monil Shah authored at least 7 papers between 2017 and 2024.

Collaborative distances:

• Dijkstra number of four.
• Erdős number of four.

2024

FSL-HDnn: A 5.7 TOPS/W End-to-end Few-shot Learning Classifier Accelerator with Feature Extraction and Hyperdimensional Computing.

Haichao Yang, Chang Eun Song, Weihong Xu, Behnam Khaleghi, Uday Mallappa, Monil Shah, Keming Fan, Mingu Kang, Tajana Rosing

CoRR, 2024

2022

PatterNet: explore and exploit filter patterns for efficient deep neural networks.

Behnam Khaleghi, Uday Mallappa, Duygu Yaldiz, Haichao Yang, Monil Shah, Jaeyoung Kang, Tajana Rosing

Proceedings of the DAC '22: 59th ACM/IEEE Design Automation Conference, San Francisco, California, USA, July 10, 2022

2019

Multi-application Based Network-on-Chip Design for Mesh-of-Tree Topology Using Global Mapping and Reconfigurable Architecture.

Mohit Upadhyay, Monil Shah, P. Veda Bhanu, Soumya J., Linga Reddy Cenkeramaddi

Proceedings of the 32nd International Conference on VLSI Design and 18th International Conference on Embedded Systems, 2019

2018

A Novel Fault-Tolerant Routing Algorithm for Mesh-of-Tree Based Network-on-Chips.

Monil Shah, Mohit Upadhyay, P. Veda Bhanu, Soumya J., Linga Reddy Cenkeramaddi

Proceedings of the VLSI Design and Test - 22nd International Symposium, 2018

A Novel Fault-Tolerant Routing Technique for Mesh-of-Tree based Network-on-Chip Design.

Mohit Upadhyay, Monil Shah, P. Veda Bhanu, Soumya J., Linga Reddy Cenkeramaddi, Henning Idsoe

Proceedings of the TENCON 2018, 2018

Fault Tolerant Routing Methodology for Mesh-of-Tree based Network-on-Chips using Local Reconfiguration.

Mohit Upadhyay, Monil Shah, P. Veda Bhanu, Soumya J., Linga Reddy Cenkeramaddi

Proceedings of the 2018 International Conference on High Performance Computing & Simulation, 2018

2017

Bike sharing data analytics for silicon valley in USA.

Xiaoming Han, Pengtao Wang, Jerry Gao, Monil Shah, Ratan Kadam Mukul Ambulgekar, Akshay Jarandikar, Subhankar Dhar

Proceedings of the 2017 IEEE SmartWorld, 2017