Mohamed Naeim

According to our database, Mohamed Naeim authored at least 5 papers between 2023 and 2025.

Collaborative distances:

• Dijkstra number of four.
• Erdős number of four.

2025

Bandwidth-Latency-Thermal Co-Optimization of Interconnect-Dominated Many-Core 3D-IC.

Sudipta Das, Samuel Riedel, Mohamed Naeim, Moritz Brunion, Marco Bertuletti, Luca Benini, Julien Ryckaert, James Myers, Dwaipayan Biswas, Dragomir Milojevic

IEEE Trans. Very Large Scale Integr. Syst., February, 2025

2024

Multidie 3-D Stacking of Memory Dominated Neuromorphic Architectures.

Leandro Mateus Giacomini Rocha, Refik Bilgic, Mohamed Naeim, Sudipta Das, Herman Oprins, Amirreza Yousefzadeh, Mario Konijnenburg, Dragomir Milojevic, James Myers, Julien Ryckaert, Dwaipayan Biswas

IEEE Trans. Very Large Scale Integr. Syst., November, 2024

Backside Power Delivery in High Density and High Performance Context: IR-Drop and Block-Level Power-Performance-Area Benefits.

Yun Zhou, S. C. Song, Halil Kükner, Giuliano Sisto, Sheng Yang, Anita Farokhnejad, Mohamed Naeim, Moritz Brunion, Ji-Yung Lin, Odysseas Zografos, Pieter Weckx, Shashank Ekbote, Nick Stevens-Yu, David Greenlaw, Steve Molloy, Geert Hellings, Julien Ryckaert

Proceedings of the IEEE Symposium on VLSI Technology and Circuits 2024, 2024

Thermal Analysis of 3D Stacking and BEOL Technologies with Functional Partitioning of Many-Core RISC-V SoC.

Mohamed Naeim, Herman Oprins, Sudipta Das, Geert Van der Plas, Yun Dai, Pinhong Chen, CT Kao, Dwaipayan Biswas, Dragomir Milojevic

Proceedings of the IEEE Computer Society Annual Symposium on VLSI, 2024

2023

Design Enablement of 3-Dies Stacked 3D-ICs Using Fine-Pitch Hybrid-Bonding and TSVs.

Mohamed Naeim, Hanqi Yang, Pinhong Chen, Rong Bao, Antoine Dekeyser, Giuliano Sisto, Moritz Brunion, Rongmei Chen, Geert Van der Plas, Eric Beyne, Dragomir Milojevic

Proceedings of the IEEE International 3D Systems Integration Conference, 2023