Mitsu Koyanagi

According to our database, Mitsu Koyanagi authored at least 4 papers between 2014 and 2018.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of five.

2018

Intra- and inter-chip electrical interconnection formed by directed self assembly of nanocomposite containing diblock copolymer and nanometal.

Mariappan Murugesan, Takafumi Fukushima, Ji Chel Bea, Hiroyuki Hashimoto, Mitsu Koyanagi

Proceedings of the IEEE International Reliability Physics Symposium, 2018

2015

Mitigating thermo mechanical stress in high-density 3D-LSI through dielectric liners in Cu- through silicon Via _ µ-RS and µ-XRD study.

Mariappan Murugesan, Jichoel Bea, Hiroyuki Hashimoto, K. W. Lee, Mitsu Koyanagi, Takafumi Fukushima, Tetsu Tanaka

Proceedings of the 2015 International 3D Systems Integration Conference, 2015

Advanced 2.5D/3D hetero-integration technologies at GINTI, Tohoku University.

K. W. Lee, Ji Chel Bea, Mitsu Koyanagi, Takafumi Fukushima, Tetsu Tanaka

Proceedings of the 2015 International 3D Systems Integration Conference, 2015

2014

Micro-XRD investigation of fine-pitch Cu-TSV induced thermo-mechanical stress in high-density 3D-LSI.

Mariappan Murugesan, Takafumi Fukushima, Ji Chel Bea, K. W. Lee, Mitsu Koyanagi, Y. Imai, S. Kimura, Tetsu Tanaka

Proceedings of the 2014 International 3D Systems Integration Conference, 2014