Ming-Yi Tsai

According to our database, Ming-Yi Tsai authored at least 16 papers between 1999 and 2022.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of five.

2022

A Novel Approach to Automate IoT Testing of Gateways and Devices.

Chien-Hung Liu, Wen-Yew Liang, Ming-Yi Tsai, Wei-Che Chang, Woei-Kae Chen

J. Inf. Sci. Eng., 2022

2019

Ultrasonic-Assisted Innovative Polyurethane Tool to Polish Mold Steel.

Ming-Yi Tsai, Yue-Feng Lin, Jihng-Kuo Ho, Jing-Guang Yang

Int. J. Autom. Technol., 2019

2018

ICAT: An IoT Device Compatibility Testing Tool.

Woei-Kae Chen, Chien-Hung Liu, William W.-Y. Liang, Ming-Yi Tsai

Proceedings of the 25th Asia-Pacific Software Engineering Conference, 2018

2016

Failure and stress analysis of through-aluminum-nitride-via substrates during thermal reliability tests for high power LED applications.

Ming-Yi Tsai, C. H. Lin, K. F. Chuang, Y. H. Chang, C. T. Wu, S. C. Hu

Microelectron. Reliab., 2016

Investigation of milling cutting forces and cutting coefficient for aluminum 6060-T6.

Ming-Yi Tsai, Sheng-Yen Chang, Jui-Pin Hung, Cheng-Chi Wang

Comput. Electr. Eng., 2016

2015

Mechanical design and analysis of direct-plated-copper aluminum nitride substrates for enhancing thermal reliability.

Ming-Yi Tsai, P. S. Huang, C. H. Lin, C. T. Wu, S. C. Hu

Microelectron. Reliab., 2015

Towards an air pollution health study data management system - A case study from a smoky Swiss railway.

Evangelia Papoutsoglou, Argyrios Samourkasidis, Ming-Yi Tsai, Mark Davey, Alex Ineichen, Marloes Eeftens, Ioannis N. Athanasiadis

Proceedings of the 29th International Conference on Environmental Informatics, 2015

2014

An investigation into warpages, stresses and keep-out zone in 3D through-silicon-via DRAM packages.

Ming-Yi Tsai, P. S. Huang, C. Y. Huang, P. C. Lin, Lawrence Huang, Michael Chang, Steven Shih, J. P. Lin

Microelectron. Reliab., 2014

2012

Thermal measurements and analyses of low-cost high-power LED packages and their modules.

Ming-Yi Tsai, C. H. Chen, C. S. Kang

Microelectron. Reliab., 2012

Strength determination of high-power LED die using point-load and line-load tests.

C. H. Chen, Ming-Yi Tsai

Microelectron. Reliab., 2012

2011

Determination of residual strains of the EMC in PBGA during manufacturing and IR solder reflow processes.

Ming-Yi Tsai, C. W. Ting, C. Y. Huang, Yi-Shao Lai

Microelectron. Reliab., 2011

2010

Fabrication and thermal analysis of flip-chip light-emitting diodes with different numbers of Au stub bumps.

Cheng-Chen Lin, Liann-Be Chang, Ming-Jer Jeng, Chia-Yi Yen, Atanu Das, Chung-Yi Tang, Ming-Yi Tsai, Mu-Jen Lai

Microelectron. Reliab., 2010

2008

Evaluation of test methods for silicon die strength.

Ming-Yi Tsai, C. H. Chen

Microelectron. Reliab., 2008

2006

Thermal deformation measurements and predictions of MAP-BGA electronic packages.

Ming-Yi Tsai, W. C. Chiang, T. M. Liu, G. H. Hsu

Microelectron. Reliab., 2006

2001

Pronunciation variation analysis with respect to various linguistic levels and contextual conditions for Mandarin Chinese.

Ming-Yi Tsai, Fu-Chiang Chou, Lin-Shan Lee

Proceedings of the EUROSPEECH 2001 Scandinavia, 2001

1999

Phonetic state tied-mixture tone modeling for large vocabulary continuous Mandarin speech recognition.

Tai-Hsuan Ho, Chin-Jung Liu, Herman Sun, Ming-Yi Tsai, Lin-Shan Lee

Proceedings of the Sixth European Conference on Speech Communication and Technology, 1999