Mike Roellig

According to our database, Mike Roellig authored at least 7 papers between 2007 and 2022.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of five.

2022

Performance Assessment of different Machine Learning Algorithm for Life-Time Prediction of Solder Joints based on Synthetic Data.

Stefan Muench, Darshankumar Bhat, Leonhard Heindel, Peter Hantschke, Mike Roellig, Markus Kästner

CoRR, 2022

2021

A new Method for the in vivo identification of material properties of the human eye. Feasibility analysis based on synthetic data.

Stefan Muench, Mike Roellig, Daniel Balzani

CoRR, 2021

2018

Validation of different SAC305 material models calibrated on isothermal tests using in-situ TMF measurement of thermally induced shear load.

Marta Kuczynska, Natalja Schafet, Ulrich Becker, René Metasch, Mike Roellig, Alexander Kabakchiev, Stefan Weihe

Microelectron. Reliab., 2018

Experimental determination of the Young's modulus of copper and solder materials for electronic packaging.

Frank Kraemer, Mike Roellig, René Metasch, Joseph Al Ahmar, Karsten Meier, Steffen Wiese

Microelectron. Reliab., 2018

Fatigue measurement setup under combined thermal and vibration loading on electronic SMT assembly.

Karsten M. Decker, René M. Rehmann, Mike Roellig, Karlheinz Bock

Microelectron. Reliab., 2018

2008

The effect of downscaling the dimensions of solder interconnects on their creep properties.

Steffen Wiese, Mike Roellig, Maik Mueller, Klaus-Jürgen Wolter

Microelectron. Reliab., 2008

2007

Fatigue analysis of miniaturized lead-free solder contacts based on a novel test concept.

Mike Roellig, Rainer Dudek, Steffen Wiese, Bjoern Boehme, Bernhard Wunderle, Klaus-Jürgen Wolter, Bernd Michel

Microelectron. Reliab., 2007