Mike Peng Li

Affiliations:
  • Intel Corporation, SerDes, high-speed I/O, HSIO, Santa Clara, CA, USA
  • Altera Corporation, San Jose, CA, USA
  • Wavecrest Corporation, CTO, San Jose, CA, USA (2000-2007)
  • University of Washington, Department of Electrical Engineering, Seattle, WA, USA (2010-2020)
  • University of Alabama in Huntsville, UAH, Huntsville, AL, USA (PhD 1991)


According to our database1, Mike Peng Li authored at least 26 papers between 1999 and 2025.

Collaborative distances:
  • Dijkstra number2 of four.
  • Erdős number3 of four.

Awards

IEEE Fellow

IEEE Fellow 2012, "For contributions to the design of jitter test technologies".

Timeline

Legend:

Book 
In proceedings 
Article 
PhD thesis 
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Links

Online presence:

On csauthors.net:

Bibliography

2025
A 0.92-pJ/b PAM-4 and 0.61-pJ/b PAM-6 224-Gb/s DAC-Based Transmitter in 3-nm FinFET.
IEEE J. Solid State Circuits, January, 2025

2024
7.2 A 224Gb/s sub pJ/b PAM-4 and PAM-6 DAC-Based Transmitter in 3nm FinFET.
Proceedings of the IEEE International Solid-State Circuits Conference, 2024

Design of 224Gb/s DSP-Based Transceiver in CMOS Technology: Signal Integrity, Architecture, Circuits, and Packaging.
Proceedings of the IEEE Custom Integrated Circuits Conference, 2024

2023
A 1.41-pJ/b 224-Gb/s PAM4 6-bit ADC-Based SerDes Receiver With Hybrid AFE Capable of Supporting Long Reach Channels.
IEEE J. Solid State Circuits, 2023

2022
A 224-Gb/s DAC-Based PAM-4 Quarter-Rate Transmitter With 8-Tap FFE in 10-nm FinFET.
IEEE J. Solid State Circuits, 2022

A 1.41pJ/b 224Gb/s PAM-4 SerDes Receiver with 31dB Loss Compensation.
Proceedings of the IEEE International Solid-State Circuits Conference, 2022

2014
Special session 8C: Hot topic: Designers' and test researchers' roles in analog design-for-test.
Proceedings of the 32nd IEEE VLSI Test Symposium, 2014

2013
Next generation backplane and copper cable challenges.
IEEE Commun. Mag., 2013

Theory, model, and applications of non-Gaussian probability density functions for random jitter/noise with non-white power spectral densities.
Proceedings of the 2013 IEEE International Test Conference, 2013

Electrical and photonic I/O test and debug.
Proceedings of the IEEE 2013 Custom Integrated Circuits Conference, 2013

Advancements in high-speed link modeling and simulation (An invited paper for CICC 2013).
Proceedings of the IEEE 2013 Custom Integrated Circuits Conference, 2013

2012
On-die instrumentation to solve challenges for 28nm, 28Gbps timing variability and stressing.
Proceedings of the 2012 IEEE International Test Conference, 2012

2009
New modeling methods for bounded Gaussian jitter (BGJ)/noise (BGN) and their applications in jitter/noise estimation/testing.
Proceedings of the 2009 IEEE International Test Conference, 2009

Emerging standards at ∼10 Gbps for wireline communications and associated integrated circuit design and validation.
Proceedings of the IEEE Custom Integrated Circuits Conference, 2009

2008
Jitter and Signal Integrity Verification for Synchronous and Asynchronous I/Os at Multiple to 10 GHz/Gbps.
Proceedings of the 2008 IEEE International Test Conference, 2008

2007
New methods for receiver internal jitter measurement.
Proceedings of the 2007 IEEE International Test Conference, 2007

2006
Jitter And Signaling Test For High-Speed Links.
Proceedings of the IEEE 2006 Custom Integrated Circuits Conference, 2006

2004
Transfer Functions For The Reference Clock Jitter In A Serial Link: Theory And Applications.
Proceedings of the Proceedings 2004 International Test Conference (ITC 2004), 2004

Will "Heisenberg Uncertainty Principle" Hold For Designing and Testing Multiple GB/s ICs?
Proceedings of the Proceedings 2004 International Test Conference (ITC 2004), 2004

Is "Design to Production" The Ultimate Answer For Jitter, Noise, and BER Challenges For Multi GB/s ICs?
Proceedings of the Proceedings 2004 International Test Conference (ITC 2004), 2004

2003
A Generic Test Path and DUT Model for DataCom ATE.
Proceedings of the Proceedings 2003 International Test Conference (ITC 2003), Breaking Test Interface Bottlenecks, 28 September, 2003

Requirements, Challenges, And Solutions For Testing Multiple GB/s ICs In Production.
Proceedings of the Proceedings 2003 International Test Conference (ITC 2003), Breaking Test Interface Bottlenecks, 28 September, 2003

Production Test Challenges And Possible Solutions For Multiple GB/s ICs.
Proceedings of the Proceedings 2003 International Test Conference (ITC 2003), Breaking Test Interface Bottlenecks, 28 September, 2003

Paradigm Shift For Jitter and Noise In Design and Test > GB/s Communication Systems.
Proceedings of the 21st International Conference on Computer Design (ICCD 2003), 2003

2002
On the Accuracy of Jitter Separation from Bit Error Rate Function.
Proceedings of the Proceedings IEEE International Test Conference 2002, 2002

1999
A new method for jitter decomposition through its distribution tail fitting.
Proceedings of the Proceedings IEEE International Test Conference 1999, 1999


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