Michiel van Soestbergen

According to our database, Michiel van Soestbergen authored at least 4 papers between 2016 and 2024.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of five.

2024

AI-Enabled Board Level Vibration Testing: Unveiling The Physics of Degradation.

Varun Thukral, Chen He, Rebecca Chen, Letian Zhang, Romuald Roucou, Michiel van Soestbergen, Jeroen J. M. Zaal, Rene Rongen, Willem D. van Driel, G. Q. Zhang

Proceedings of the IEEE International Test Conference, 2024

2023

Transient Leakage Current as a Non-destructive Probe of Wire-bond Electrochemical Failures.

Md. Asaduz Zaman Mamun, Amar Mavinkurve, Michiel van Soestbergen, Muhammad Ashraful Alam

Proceedings of the IEEE International Reliability Physics Symposium, 2023

2021

Moisture diffusion rate in an ultra-low-k dielectric and its effect on the dielectric reliability.

Ning Duan, Vignesh Subramanian, Edgar Olthof, Paul Eggenkamp, Michiel van Soestbergen, Richard Braspenning

Proceedings of the IEEE International Reliability Physics Symposium, 2021

2016

Moisture absorption by molding compounds under extreme conditions: Impact on accelerated reliability tests.

Amar Mavinkurve, Jaume L. M. Llacer Martinez, Michiel van Soestbergen, Jeroen J. M. Zaal

Microelectron. Reliab., 2016