Michal Rakowski

High-Power Micro-Ring Modulator and Multi-Channel Coupled Ring Resonator for WDM Design on a 300-mm Monolithic Foundry Platform.

[BibT_eX]

[DOI]

Proceedings of the Optical Fiber Communications Conference and Exhibition, 2024

High Performance Silicon Nitride Passive Optical Components on Monolithic Silicon Photonics Platform.

[BibT_eX]

[DOI]

Proceedings of the Optical Fiber Communications Conference and Exhibition, 2024

Mitigating substrate leakage loss on a monolithic SiPh platform: experimental demonstration of hybrid Si-SiN waveguides for O-band datacom.

[BibT_eX]

[DOI]

Proceedings of the Optical Fiber Communications Conference and Exhibition, 2024

Monolithically integrated self-aligned SiN edge coupler with 520 mW high-power handling capability.

[BibT_eX]

[DOI]

Proceedings of the Optical Fiber Communications Conference and Exhibition, 2023

Polarization mode dispersion in CMOS-integrated monolithic SiPh components: simulations and experiments.

[BibT_eX]

[DOI]

Proceedings of the Optical Fiber Communications Conference and Exhibition, 2023

Nickel Silicide Electromigration on Micro Ring Modulators for Silicon Photonics Technology.

[BibT_eX]

[DOI]

Brian T. McGowan

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Michal Rakowski

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Seungman Choi

Proceedings of the IEEE International Reliability Physics Symposium, 2023

Monolithic Silicon Photonics.

[BibT_eX]

[DOI]

Proceedings of the IEEE BiCMOS and Compound Semiconductor Integrated Circuits and Technology Symposium, 2023

Automatic Waveguide Balancing Using Point Set Operations.

[BibT_eX]

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Proceedings of the Optical Fiber Communications Conference and Exhibition, 2022

High Performance Avalanche Photodiode in a Monolithic Silicon Photonics Technology.

[BibT_eX]

[DOI]

Proceedings of the Optical Fiber Communications Conference and Exhibition, 2022

Hybrid III-V laser integration on a monolithic silicon photonic platform.

[BibT_eX]

[DOI]

Proceedings of the Optical Fiber Communications Conference and Exhibition, 2021

Monolithically integrated silicon nitride platform.

[BibT_eX]

[DOI]

Proceedings of the Optical Fiber Communications Conference and Exhibition, 2021

Towards fully automated testing and characterization for photonic compact modeling on 300-mm wafer platform.

[BibT_eX]

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Proceedings of the Optical Fiber Communications Conference and Exhibition, 2021

45nm CMOS - Silicon Photonics Monolithic Technology (45CLO) for Next-Generation, Low Power and High Speed Optical Interconnects.

[BibT_eX]

[DOI]

Proceedings of the Optical Fiber Communications Conference and Exhibition, 2020

A CMOS Compatible Monolithic Fiber Attach Solution with Reliable Performance and Self-Alignment.

[BibT_eX]

[DOI]

Proceedings of the Optical Fiber Communications Conference and Exhibition, 2020

Packaging and Assembly Challenges for 50G Silicon Photonics Interposers.

[BibT_eX]

[DOI]

Bradley Snyder

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Nivesh Mangal

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Guy Lepage

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Sadhishkumar Balakrishnan

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Proceedings of the Optical Fiber Communications Conference and Exposition, 2018

A 50Gb/s, 610fJ/bit hybrid CMOS-Si photonics ring-based NRZ-OOK transmitter.

[BibT_eX]

[DOI]

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Proceedings of the Optical Fiber Communications Conference and Exhibition, 2016

50Gb/s silicon photonics platform for short-reach optical interconnects.

[BibT_eX]

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Proceedings of the Optical Fiber Communications Conference and Exhibition, 2016

Wavelength locking of a Si photonic ring transmitter using a dithering-based OMA stabilizing feedback loop.

[BibT_eX]

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Proceedings of the Optical Fiber Communications Conference and Exhibition, 2016

22.5 A 4×20Gb/s WDM ring-based hybrid CMOS silicon photonics transceiver.

[BibT_eX]

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Proceedings of the 2015 IEEE International Solid-State Circuits Conference, 2015

Wavelength locking of a Si ring modulator using an integrated drop-port OMA monitoring circuit.

[BibT_eX]

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Proceedings of the IEEE Asian Solid-State Circuits Conference, 2015

Monitoring optical modulation amplitude using a low-power CMOS circuit for thermal control of Si ring transmitters.

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Proceedings of the European Conference on Optical Communication, 2014

Low-power, low-penalty, flip-chip integrated, 10Gb/s ring-based 1V CMOS photonics transmitter.

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Proceedings of the 2013 Optical Fiber Communication Conference and Exposition and the National Fiber Optic Engineers Conference (OFC/NFOEC), 2013

Low-Power, 10-Gbps 1.5-Vpp differential CMOS driver for a silicon electro-optic ring modulator.

[BibT_eX]

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Proceedings of the IEEE 2012 Custom Integrated Circuits Conference, 2012

Design issues and considerations for low-cost 3D TSV IC technology.

[BibT_eX]

[DOI]

Proceedings of the IEEE International Solid-State Circuits Conference, 2010

Migrating from planar to FinFET for further CMOS scaling: SOI or bulk?

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Proceedings of the 35th European Solid-State Circuits Conference, 2009

3D Stacked IC demonstrator using Hybrid Collective Die-to-Wafer bonding with copper Through Silicon Vias (TSV).

[BibT_eX]

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Proceedings of the IEEE International Conference on 3D System Integration, 2009

Hierarchical Analysis of Short Defects between Metal Lines in CMOS IC.

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Proceedings of the 11th Euromicro Conference on Digital System Design: Architectures, 2008

Layout to Logic Defect Analysis for Hierarchical Test Generation.

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Proceedings of the 10th IEEE Workshop on Design & Diagnostics of Electronic Circuits & Systems (DDECS 2007), 2007

Michal Rakowski

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