Michal Bladowski

According to our database, Michal Bladowski authored at least 1 paper in 2018.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of six.

2018

Reflow Oven for Heating and Soldering SMD and BGA Components.

Pawel Pawlowski, Adam Dabrowski, Marcin Grenz, Michal Bladowski

Proceedings of the 25th International Conference "Mixed Design of Integrated Circuits and System", 2018