Melanie Brocard

According to our database, Melanie Brocard authored at least 8 papers between 2012 and 2017.

Collaborative distances:

• Dijkstra number of four.
• Erdős number of four.

2017

High-Density 4T SRAM Bitcell in 14-nm 3-D CoolCube Technology Exploiting Assist Techniques.

Reda Boumchedda, Jean-Philippe Noel, Bastien Giraud, Kaya Can Akyel, Melanie Brocard, David Turgis, Edith Beigné

IEEE Trans. Very Large Scale Integr. Syst., 2017

Transistor Temperature Deviation Analysis in Monolithic 3D Standard Cells.

Melanie Brocard, Benoît Mathieu, Jean-Philippe Colonna, Cristiano Santos, Claire Fenouillet-Béranger, Cao-Minh Vincent Lu, Gerald Cibrario, Laurent Brunet, Perrine Batude, François Andrieu, Sébastien Thuries, Olivier Billoint

Proceedings of the 2017 IEEE Computer Society Annual Symposium on VLSI, 2017

2016

Recent advances in 3D VLSI integration.

Claire Fenouillet-Béranger, Perrine Batude, Laurent Brunet, Vincent Mazzocchi, Cao-Minh Vincent Lu, Fabien Deprat, Jessy Micout, M.-P. Samson, Bernard Previtali, Paul Besombes, Nils Rambal, François Andrieu, Olivier Billoint, Melanie Brocard, Sébastien Thuries, Gerald Cibrario, Maud Vinet

Proceedings of the International Conference on IC Design and Technology, 2016

Opportunities brought by sequential 3D CoolCube™ integration.

Maud Vinet, Perrine Batude, Claire Fenouillet-Béranger, Laurent Brunet, Vincent Mazzocchi, Cao-Minh Vincent Lu, Fabien Deprat, Jessy Micout, Bernard Previtali, Paul Besombes, Nils Rambal, François Andrieu, Olivier Billoint, Melanie Brocard, Sébastien Thuries, Guillaume Berhault, Cristiano Lopes Dos Santos, Gerald Cibrario, Fabien Clermidy, Daniel Gitlin, Olivier Faynot

Proceedings of the 46th European Solid-State Device Research Conference, 2016

Impact of intermediate BEOL technology on standard cell performances of 3D VLSI.

Melanie Brocard, Guillaume Berhault, Sébastien Thuries, Fabien Clermidy, Perrine Batude, Claire Fenouillet-Béranger, Laurent Brunet, François Andrieu, Fabien Deprat, Joris Lacord, Olivier Rozeau, Gerald Cibrario, Olivier Billoint

Proceedings of the 46th European Solid-State Device Research Conference, 2016

3DIP: An iterative partitioning tool for monolithic 3D IC.

Guillaume Berhault, Melanie Brocard, Sébastien Thuries, François Galea, Lilia Zaourar

Proceedings of the 2016 IEEE International 3D Systems Integration Conference, 2016

2013

RF characterization of substrate coupling between TSV and MOS transistors in 3D integrated circuits.

Melanie Brocard, Cédric Bermond, Thierry Lacrevaz, Alexis Farcy, Patrick Le Maitre, P. Scheer, Patrick Leduc, Séverine Cheramy, Bernard Fléchet

Proceedings of the 2013 IEEE International 3D Systems Integration Conference (3DIC), 2013

2012

Device and electromagnetic co-simulation of TSV: Substrate noise study and compact modeling of a TSV in a matrix.

Patrick Le Maitre, Melanie Brocard, Alexis Farcy, Jean-Claude Marin

Proceedings of the Thirteenth International Symposium on Quality Electronic Design, 2012