Meike Hauschildt

According to our database, Meike Hauschildt authored at least 3 papers between 2018 and 2024.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of five.

2024

A Novel Method for the Determination of Electromigration-Induced Void Nucleation Stresses.

J. Shuster-Passage, S. Abdel Razek, M. Mattoo, Meike Hauschildt, Seungman Choi, Martin Gall, Armen Kteyan, Jun-Ho Choy, Valeriy Sukharev, Matthias Kraatz, J. R. Lloyd

Proceedings of the IEEE International Reliability Physics Symposium, 2024

2021

Strategy to Characterize Electromigration Short Length Effects in Cu/low-k Interconnects.

Zhenjun Zhang, Matthias Kraatz, Meike Hauschildt, Seungman Choi, André Clausner, Ehrenfried Zschech, Martin Gall

Proceedings of the IEEE International Reliability Physics Symposium, 2021

2018

Analysis of electromigration-induced backflow stresses in Cu(Mn) interconnects using high statistical sampling.

Matthias Kraatz, Christoph Sander, André Clausner, Meike Hauschildt, Yvonne Standke, Martin Gall, Ehrenfried Zschech

Proceedings of the IEEE International Reliability Physics Symposium, 2018