Mei-Ling Wu

According to our database, Mei-Ling Wu authored at least 3 papers between 2010 and 2018.

Collaborative distances:

• Dijkstra number of six.
• Erdős number of six.

2018

Reliability and failure analysis of SAC 105 and SAC 1205N lead-free solder alloys during drop test events.

Mei-Ling Wu, Jia-Shen Lan

Microelectron. Reliab., 2018

2010

Rapid assessment of BGA life under vibration and bending, and influence of input parameter uncertainties.

Mei-Ling Wu, Donald Barker

Microelectron. Reliab., 2010

Design of experiments to investigate reliability for solder joints PBGA package under high cycle fatigue.

Mei-Ling Wu

Microelectron. Reliab., 2010