Mehul D. Shroff

According to our database, Mehul D. Shroff authored at least 5 papers between 2016 and 2021.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2021

An efficient methodology to evaluate BEOL and MOL TDDB in advanced nodes.

Sumy Jose, Chunshan Yin, Yu Chen, Cheong Min Hong, Mehul D. Shroff, Xiaoling Zhao, Fan Zhang

Proceedings of the IEEE International Reliability Physics Symposium, 2021

2020

Full-chip wire-oriented back-end-of-line TDDB hotspot detection and lifetime analysis.

Shaoyi Peng, Ertugrul Demircan, Mehul D. Shroff, Sheldon X.-D. Tan

Integr., 2020

2018

Fast Electromigration Stress Evolution Analysis for Interconnect Trees Using Krylov Subspace Method.

Chase Cook, Zeyu Sun, Ertugrul Demircan, Mehul D. Shroff, Sheldon X.-D. Tan

IEEE Trans. Very Large Scale Integr. Syst., 2018

Fast Electromigration Immortality Analysis for Multisegment Copper Interconnect Wires.

Zeyu Sun, Ertugrul Demircan, Mehul D. Shroff, Chase Cook, Sheldon X.-D. Tan

IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2018

2016

Voltage-based electromigration immortality check for general multi-branch interconnects.

Zeyu Sun, Ertugrul Demircan, Mehul D. Shroff, Taeyoung Kim, Xin Huang, Sheldon X.-D. Tan

Proceedings of the 35th International Conference on Computer-Aided Design, 2016