Mauro Scandiuzzo

According to our database1, Mauro Scandiuzzo authored at least 10 papers between 2005 and 2011.

Collaborative distances:
  • Dijkstra number2 of five.
  • Erdős number3 of five.

Timeline

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Links

On csauthors.net:

Bibliography

2011
Automatic Compensation of the Voltage Attenuation in 3-D Interconnection Based on Capacitive Coupling.
IEEE J. Solid State Circuits, 2011

Input/Output Pad for Direct Contact and Contactless Testing.
Proceedings of the 16th European Test Symposium, 2011

2010
Characterization of chip-to-chip wireless interconnections based on capacitive coupling.
Proceedings of the 18th IEEE/IFIP VLSI-SoC 2010, 2010

3D system on chip memory interface based on modeled capacitive coupling interconnections.
Proceedings of the IEEE International Conference on 3D System Integration, 2010

2009
3D capacitive transmission of analog signals with automatic compensation of the voltage attenuation.
Proceedings of the 35th European Solid-State Circuits Conference, 2009

System on chip with 1.12mW-32Gb/s AC-coupled 3D memory interface.
Proceedings of the IEEE Custom Integrated Circuits Conference, 2009

Chip-to-chip communication based on capacitive coupling.
Proceedings of the IEEE International Conference on 3D System Integration, 2009

2007
A CMOS 3-D Imager Based on Single Photon Avalanche Diode.
IEEE Trans. Circuits Syst. I Regul. Pap., 2007

2005
Design of electro-optical demodulating pixel in CMOS technology.
Proceedings of the International Symposium on Circuits and Systems (ISCAS 2005), 2005

A single-photon-avalanche-diode 3D imager.
Proceedings of the 31st European Solid-State Circuits Conference, 2005


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