Mauro J. Kobrinsky

According to our database, Mauro J. Kobrinsky authored at least 5 papers between 2014 and 2023.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2023

2D Materials in the BEOL.

C. H. Naylor, Kirby Maxey, C. Jezewski, K. P. O'Brien, A. V. Penumatcha, M. S. Kavrik, B. Agrawal, C. V. Littlefield, J. Lux, B. Barley, Justin R. Weber, A. Sen Gupta, C. J. Dorow, N. Arefin, S. King, R. Chebiam, J. Plombon, S. B. Clendenning, U. E. Avci, Mauro J. Kobrinsky, M. Metz

Proceedings of the 2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits), 2023

Novel Cell Architectures with Back-side Transistor Contacts for Scaling and Performance.

Mauro J. Kobrinsky, J. D. Silva, E. Mannebach, S. Mills, M. Abd El Qader, O. Adebayo, N. Arkali Radhakrishna, M. Beasley, J. Chawla, S. Chugh, A. Dasgupta, U. Desai, E. De Re, G. Dewey, T. Edwards, C. Engel, V. Gudmundsson, Jeffery Hicks, B. Krist, R. Mehandru, Inanc Meric, Patrick Morrow, D. Nandi, P. Patel, R. Ramamurthy, D. Samanta, L. Shoer, A. St Amour, L. H. Tan, Sukru Yemenicioglu, X. Wang, T. Ghani

Proceedings of the 2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits), 2023

2021

Back End Of Line opportunities and reliability challenges for future technology nodes.

Mauro J. Kobrinsky, Rahim Kasim

Proceedings of the IEEE International Reliability Physics Symposium, 2021

2015

Wafer-level electromigration for reliability monitoring: Quick-turn electromigration stress with correlation to package-level stress.

D. Slottke, R. J. Kamaladasa, M. Harmes, Ilan Tsameret, Mauro J. Kobrinsky, Timothy McMullen, John Dunklee

Proceedings of the IEEE International Reliability Physics Symposium, 2015

2014

Laser integration with CMOS assembly process for Si photonics.

Ricky Tseng, James O'Callaghan, Feras Eid, Michael Gleeson, Brandon Rawlings, Mauro J. Kobrinsky, Ibrahim Ban, Roger Nagle, William McFarlane, Brian Corbett, Peter Chang

Proceedings of the Optical Fiber Communications Conference and Exhibition, 2014