Matthias Petzold

According to our database, Matthias Petzold authored at least 8 papers between 1991 and 2017.

Collaborative distances:

• Dijkstra number of four.
• Erdős number of four.

2017

XRD and ToF-SIMS study of intermetallic void formation in Cu-Sn micro-connects.

Glenn Ross, Vesa Vuorinen, Michael Krause, S. Reissaus, Matthias Petzold, Mervi Paulasto-Kröckel

Microelectron. Reliab., 2017

2016

Editorial: ESREF 2016.

Matthias Petzold

Microelectron. Reliab., 2016

Innovative Failure Analysis Techniques for 3-D Packaging Developments.

Frank Altmann, Matthias Petzold

IEEE Des. Test, 2016

2014

Lifetime prediction of thick aluminium wire bonds for mechanical cyclic loads.

Lutz Merkle, Marcus Sonner, Matthias Petzold

Microelectron. Reliab., 2014

Interface microstructure effects in Au thermosonic ball bonding contacts by high reliability wire materials.

Benjamin März, Andreas Graff, Robert Klengel, Matthias Petzold

Microelectron. Reliab., 2014

2011

Room temperature wedge-wedge ultrasonic bonding using aluminum coated copper wire.

Rainer Dohle, Matthias Petzold, Robert Klengel, Holger Schulze, Frank Rudolf

Microelectron. Reliab., 2011

2010

Automated inspection and classification of flip-chip-contacts using scanning acoustic microscopy.

Sebastian Brand, P. Czurratis, P. Hoffrogge, Matthias Petzold

Microelectron. Reliab., 2010

1991

Methoden und Programme zur rechnergestützten Anpassungskonstruktion von Justier- und Prüfmittelbaugruppen.

Matthias Petzold

PhD thesis, 1991