Mathias Plappert

According to our database, Mathias Plappert authored at least 2 papers between 2012 and 2014.

Collaborative distances:

• Dijkstra number of seven.
• Erdős number of six.

2014

Comparison of WTi and WTi(N) as diffusion barriers for Al and Cu metallization on Si with respect to thermal stability and diffusion behavior of Ti.

Michael Fugger, Mathias Plappert, Carsten Schäffer, Oliver Humbel, Herbert Hutter, Herbert Danninger, Mathias Nowottnick

Microelectron. Reliab., 2014

2012

Characterization of Ti diffusion in PVD deposited WTi/AlCu metallization on monocrystalline Si by means of secondary ion mass spectroscopy.

Mathias Plappert, Oliver Humbel, Angelika Koprowski, Mathias Nowottnick

Microelectron. Reliab., 2012