Mathias Nowottnick
Affiliations:- University of Rostock, Electrical Engineering, Germany
According to our database1,
Mathias Nowottnick
authored at least 6 papers
between 2011 and 2018.
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Bibliography
2018
Reliability investigation of large area solder joints in power electronics modules and its simulative representation.
Microelectron. Reliab., 2018
Selective Soldering on Printed Circuit Boards with Endogenous Induction Heat at Appropriate Susceptors.
Period. Polytech. Electr. Eng. Comput. Sci., 2018
2017
Highly variable Sn-Cu diffusion soldering process for high performance power electronics.
Microelectron. Reliab., 2017
2014
Comparison of WTi and WTi(N) as diffusion barriers for Al and Cu metallization on Si with respect to thermal stability and diffusion behavior of Ti.
Microelectron. Reliab., 2014
2012
Characterization of Ti diffusion in PVD deposited WTi/AlCu metallization on monocrystalline Si by means of secondary ion mass spectroscopy.
Microelectron. Reliab., 2012
2011