Masatsugu Nimura

According to our database, Masatsugu Nimura authored at least 3 papers between 2011 and 2016.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of five.

2016

Evaluation of hybrid bonding technology of single-micron pitch with planar structure for 3D interconnection.

Masaki Ohyama, Masatsugu Nimura, Jun Mizuno, Shuichi Shoji, Toshihisa Nonaka, Yoichi Shinba, Akitsu Shigetou

Microelectron. Reliab., 2016

2015

High productivity thermal compression bonding for 3D-IC.

Noboru Asahi, Yoshinori Miyamoto, Masatsugu Nimura, Yoshihito Mizutani, Yoshiyuki Arai

Proceedings of the 2015 International 3D Systems Integration Conference, 2015

2011

Low temperature Au-Au bonding with VUV/O3 treatment.

Akiko Okada, Masatsugu Nimura, Naoko Unami, Akitsu Shigetou, Hirokazu Noma, Katsuyuki Sakuma, Jun Mizuno, Shuichi Shoji

Proceedings of the 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31, 2011