Masanori Usui

Orcid: 0000-0002-2227-5983

According to our database1, Masanori Usui authored at least 10 papers between 2002 and 2017.

Collaborative distances:
  • Dijkstra number2 of five.
  • Erdős number3 of five.

Timeline

Legend:

Book 
In proceedings 
Article 
PhD thesis 
Dataset
Other 

Links

Online presence:

On csauthors.net:

Bibliography

2017
Effects of thermal aging on Cu nanoparticle/Bi-Sn solder hybrid bonding.
Microelectron. Reliab., 2017

Young's modulus of a sintered Cu joint and its influence on thermal stress.
Microelectron. Reliab., 2017

2016
Degradation of a sintered Cu nanoparticle layer studied by synchrotron radiation computed laminography.
Microelectron. Reliab., 2016

Power cycle reliability of Cu nanoparticle joints with mismatched coefficients of thermal expansion.
Microelectron. Reliab., 2016

2015
Thermal simulation of joints with high thermal conductivities for power electronic devices.
Microelectron. Reliab., 2015

Thermal cycle reliability of Cu-nanoparticle joint.
Microelectron. Reliab., 2015

2011
Warpage analysis of layered structures connected by direct brazing.
Microelectron. Reliab., 2011

2006
Design concept for wire-bonding reliability improvement by optimizing position in power devices.
Microelectron. J., 2006

2005
Effects of uni-axial mechanical stress on IGBT characteristics.
Microelectron. Reliab., 2005

2002
Characterization of Trench MOS Gate Structures Utilizing Photon Emission Microscopy.
Microelectron. Reliab., 2002


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