Masaharu Kobayashi
Orcid: 0000-0002-7945-6136
According to our database1,
Masaharu Kobayashi
authored at least 16 papers
between 1986 and 2025.
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Bibliography
2025
Proceedings of the 30th Asia and South Pacific Design Automation Conference, 2025
2024
Scaling Potential of Nanosheet Oxide Semiconductor FETs for Monolithic 3D Integration-ALD Material Engineering, High-Field Transport, Statistical Variability.
Proceedings of the IEEE Symposium on VLSI Technology and Circuits 2024, 2024
Performance and Reliability of Nanosheet Oxide Semiconductor FETs with ALD-Grown InGaO for 3D Integration (Invited).
Proceedings of the IEEE International Reliability Physics Symposium, 2024
2023
A Nanosheet Oxide Semiconductor FET Using ALD InGaOx Channel and InSnOx Electrode with Normally-off Operation, High Mobility and Reliability for 3D Integrated Devices.
Proceedings of the 2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits), 2023
2022
Monolithic 3D Integration of Oxide Semiconductor FETs and Memory Devices for AI Acceleration (Invited).
Proceedings of the IEEE International Reliability Physics Symposium, 2022
3-Layer stacked pixel-parallel CMOS image sensors using hybrid bonding of SOI wafers.
Proceedings of the Imaging Sensors and Systems 2022, online, January 15-26, 2022, 2022
2020
A penalized spline fitting method to optimize geometric parameters of arterial centerlines extracted from medical images.
Comput. Medical Imaging Graph., 2020
2019
Scalability Study on Ferroelectric-HfO2 Tunnel Junction Memory Based on Non-equilibrium Green Function Method.
Proceedings of the 19th Non-Volatile Memory Technology Symposium, 2019
Comprehensive Understanding of Negative Capacitance FET From the Perspective of Transient Ferroelectric Model.
Proceedings of the 13th IEEE International Conference on ASIC, 2019
Triple-Layering Technology for Pixel-Parallel CMOS Image Sensors Developed by Hybrid Bonding of SOI Wafers.
Proceedings of the 2019 International 3D Systems Integration Conference (3DIC), 2019
2018
Quarter Video Graphics Array Full-Digital Image Sensing with Wide Dynamic Range and Linear Output Using Pixel-Wise 3D Integration.
Proceedings of the IEEE International Symposium on Circuits and Systems, 2018
2017
Proceedings of the 12th IEEE International Conference on ASIC, 2017
Proceedings of the 12th IEEE International Conference on ASIC, 2017
2015
Three-dimensional integrated circuits and stacked CMOS image sensors using direct bonding of SOI layers.
Proceedings of the 2015 International 3D Systems Integration Conference, 2015
1986
Proceedings of the IEEE International Conference on Acoustics, 1986
Proceedings of the IEEE International Conference on Acoustics, 1986