Martin R. Corfield

Affiliations:

University of Nottingham, Department of Electrical and Electronic Engineering, UK

According to our database¹, Martin R. Corfield authored at least 3 papers between 2011 and 2016.

Collaborative distances:

Dijkstra number² of five.
Erdős number³ of five.

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Bibliography

2016

A thermal cycling reliability study of ultrasonically bonded copper wires.

[BibT_eX]

[DOI]

Microelectron. Reliab., 2016

2012

Repetitive high peak current pulsed discharge film-capacitor reliability testing.

[BibT_eX]

[DOI]

Microelectron. Reliab., 2012

2011

Microstructural evolution of ultrasonically bonded high purity Al wire during extended range thermal cycling.

[BibT_eX]

[DOI]

Microelectron. Reliab., 2011

Martin R. Corfield

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