Markus Wimplinger

According to our database, Markus Wimplinger authored at least 5 papers between 2008 and 2024.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2024

EOT Scaling Via 300mm MX2 Dry Transfer - Steps Toward a Manufacturable Process Development and Device Integration.

S. Ghosh, A. Kruv, Quentin Smets, Tom Schram, D. J. Leech, T. Ding, V. Turkani, Benjamin Groven, A. Dangel, G. Probst, Thomas Uhrmann, Markus Wimplinger, Inge Asselberghs, Cesar J. Lockhart de la Rosa, Steven Brems, Gouri Sankar Kar

Proceedings of the IEEE Symposium on VLSI Technology and Circuits 2024, 2024

2016

Importance of alignment control during permanent bonding and its impact on via-last alignment for high density 3D interconnects.

Joeri De Vos, Lan Peng, Alain Phommahaxay, Joost Van Ongeval, Andy Miller, Eric Beyne, Florian Kurz, Thomas Wagenleiter, Markus Wimplinger, Thomas Uhrmann

Proceedings of the 2016 IEEE International 3D Systems Integration Conference, 2016

2013

Recent progress in thin wafer processing.

Thomas Uhrmann, Thorsten Matthias, Markus Wimplinger, Jurgen Burggraf, Daniel Burgstaller, Harald Wiesbauer, Paul Lindner

Proceedings of the 2013 IEEE International 3D Systems Integration Conference (3DIC), 2013

2009

Advanced wafer bonding solutions for TSV integration with thin wafers.

Bioh Kim, Thorsten Matthias, Markus Wimplinger, Paul Lindner

Proceedings of the IEEE International Conference on 3D System Integration, 2009

2008

Novel Bonding technologies for wafer-level transparent packaging of MOEMS

Herwig Kirchberger, Paul Lindner, Markus Wimplinger

CoRR, 2008