Markus Gabriel
According to our database1,
Markus Gabriel
authored at least 3 papers
between 2010 and 2021.
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Bibliography
2021
Proceedings of the Robotics, AI, and Humanity, 2021
2011
Ultrathin wafer handling in 3D Stacked IC manufacturing combining a novel ZoneBOND™ temporary bonding process with room temperature peel debonding.
Proceedings of the 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31, 2011
2010
Equipment challenges and solutions for diverse temporary bonding and de-bonding processes in 3D integration.
Proceedings of the IEEE International Conference on 3D System Integration, 2010