Murugesan Mariappan

According to our database, Murugesan Mariappan authored at least 33 papers between 2009 and 2024.

Collaborative distances:

• Dijkstra number of four.
• Erdős number of five.

2024

Characterization of Ozone-Ethylene Radical Pretreatment for Hybrid Bonding without Water Rinsing Processes.

Bungo Tanaka, Tatsunori Shino, Murugesan Mariappan, Tetsu Tanaka, Takafumi Fukushima

Proceedings of the International 3D Systems Integration Conference, 2024

Impact of Cu Pad Density on Cu-CMP and Bonding Yield for Chip-to-Wafer Hybrid Bonding.

Mariappan Murugesan, Hiroyuki Hashimoto, Kentaro Mihara, Takashi Hare, Takafumi Fukushima, Fumihiro Inoue, Akira Uedono

Proceedings of the International 3D Systems Integration Conference, 2024

Antioxidative Cu Electrodeposition for 3D Interconnects with Hybrid Bonding.

Ryo Aizawa, Masahiro Sawa, Jinta Nampo, Yurina Fukumoto, Murugesan Mariappan, Takafumi Fukushima

Proceedings of the International 3D Systems Integration Conference, 2024

2023

Impact of Super-long-throw PVD on TSV Metallization and Die-to-Wafer 3D Integration Based on Via-last.

Jiayi Shen, Chang Liu, Tadaaki Hoshi, Atsushi Shinoda, Hisashi Kino, Tetsu Tanaka, Mariappan Murugesan, Mitsumasa Koyanagi, Takafumi Fukushima

Proceedings of the IEEE International 3D Systems Integration Conference, 2023

Copper Electrode Surface Features and Cu-SiO2Hybrid Bonding.

Mariappan Murugesan, M. Sawa, E. Sone, Makoto Motoyoshi, Mitsumasa Koyanagi, Takafumi Fukushima

Proceedings of the IEEE International 3D Systems Integration Conference, 2023

2021

Cu-Cu Direct Bonding Through Highly Oriented Cu Grains for 3D-LSI Applications.

Mariappan Murugesan, E. Sone, A. Simomura, Makoto Motoyoshi, M. Sawa, K. Fukuda, Mitsumasa Koyanagi, Takafumi Fukushima

Proceedings of the IEEE International 3D Systems Integration Conference, 2021

Integration of Damage-less Probe Cards Using Nano-TSV Technology for Microbumped Wafer Testing.

Takafumi Fukushima, Shinichi Sakuyama, Masatomo Takahashi, Hiroyuki Hashimoto, Jichoel Bea, Theodorus Marcello, Hisashi Kino, Tetsu Tanaka, Mitsumasa Koyanagi, Mariappan Murugesan

Proceedings of the IEEE International 3D Systems Integration Conference, 2021

2019

Fabrication and Morphological Characterization of Nano-Scale Interconnects for 3D-Integration.

Mariappan Murugesan, Mitsumasa Koyanagi, Hiroyuki Hashimoto, Ji Chel Bea, Takafumi Fukushima

Proceedings of the 2019 International 3D Systems Integration Conference (3DIC), 2019

Growth Optimization of Multi-Layer Graphene for Thermal-TSV Application in 3D-LSI.

Mariappan Murugesan, Mitsumasa Koyanagi, Takafumi Fukushima

Proceedings of the 2019 International 3D Systems Integration Conference (3DIC), 2019

Impacts of Deposition Temperature and Annealing Condition on Ozone-Ethylene Radical Generation-TEOS-CVD SiO2 for Low-Temperature TSV Liner Formation.

Rui Liang, Sungho Lee, Yuki Miwa, Kousei Kumahara, Mariappan Murugesan, Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka

Proceedings of the 2019 International 3D Systems Integration Conference (3DIC), 2019

2018

Intra- and inter-chip electrical interconnection formed by directed self assembly of nanocomposite containing diblock copolymer and nanometal.

Mariappan Murugesan, Takafumi Fukushima, Ji Chel Bea, Hiroyuki Hashimoto, Mitsu Koyanagi

Proceedings of the IEEE International Reliability Physics Symposium, 2018

2016

Oxide-Oxide Thermocompression Direct Bonding Technologies with Capillary Self-Assembly for Multichip-to-Wafer Heterogeneous 3D System Integration.

Takafumi Fukushima, Hideto Hashiguchi, Hiroshi Yonekura, Hisashi Kino, Mariappan Murugesan, Ji Chel Bea, Kang Wook Lee, Tetsu Tanaka, Mitsumasa Koyanagi

Micromachines, 2016

Improving the integrity of Ti barrier layer in Cu-TSVs through self-formed TiSix for via-last TSV technology.

Mariappan Murugesan, Jichel Bea, Takafumi Fukushima, Makoto Motoyoshi, Tetsu Tanaka, Mitsumasa Koyanagi

Proceedings of the 2016 IEEE International 3D Systems Integration Conference, 2016

3 Dimensional stacked pixel detector and sensor technology using less than 3-μmφ robust bump junctions.

Makoto Motoyoshi, Kohki Yanagimura, Taikoh Fushimi, Junichi Takanohashi, Mariappan Murugesan, Masahiro Aoyagi, Mitsumasa Koyanagi

Proceedings of the 2016 IEEE International 3D Systems Integration Conference, 2016

New concept of TSV formation methodology using Directed Self-Assembly (DSA).

Takafumi Fukushima, Mariappan Murugesan, Shin Ohsaki, Hiroyuki Hashimoto, Jichoel Bea, Kang Wook Lee, Tetsu Tanaka, Mitsumasa Koyanagi

Proceedings of the 2016 IEEE International 3D Systems Integration Conference, 2016

2015

Impacts of 3-D integration processes on device reliabilities in thinned DRAM chip for 3-D DRAM.

Kang Wook Lee, Ji Chel Bea, Mariappan Murugesan, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi

Proceedings of the IEEE International Reliability Physics Symposium, 2015

Mitigating thermo mechanical stress in high-density 3D-LSI through dielectric liners in Cu- through silicon Via _ µ-RS and µ-XRD study.

Mariappan Murugesan, Jichoel Bea, Hiroyuki Hashimoto, K. W. Lee, Mitsu Koyanagi, Takafumi Fukushima, Tetsu Tanaka

Proceedings of the 2015 International 3D Systems Integration Conference, 2015

Transfer and non-transfer stacking technologies based on chip-to-wafer self-asembly for high-throughput and high-precision alignment and microbump bonding.

Takafumi Fukushima, Taku Suzuki, Hideto Hashiguchi, Chisato Nagai, Jichoel Bea, Hiroyuki Hashimoto, Mariappan Murugesan, Kang Wook Lee, Tetsu Tanaka, Kazushi Asami, Yasuhiro Kitamura, Mitsumasa Koyanagi

Proceedings of the 2015 International 3D Systems Integration Conference, 2015

2014

Micro-XRD investigation of fine-pitch Cu-TSV induced thermo-mechanical stress in high-density 3D-LSI.

Mariappan Murugesan, Takafumi Fukushima, Ji Chel Bea, K. W. Lee, Mitsu Koyanagi, Y. Imai, S. Kimura, Tetsu Tanaka

Proceedings of the 2014 International 3D Systems Integration Conference, 2014

Effects of electro-less Ni layer as barrier/seed layers for high reliable and low cost Cu TSV.

K. W. Lee, Chisato Nagai, Ai Nakamura, Ji Chel Bea, Mariappan Murugesan, Takafumi Fukushima, Tanaka Tanaka, Mitsumasa Koyanagi

Proceedings of the 2014 International 3D Systems Integration Conference, 2014

Tiny VCSEL chip self-assembly for advanced chip-to-wafer 3D and hetero integration.

Takafumi Fukushima, Yuka Ito, Mariappan Murugesan, Jicheol Bea, Kang Wook Lee, Koji Choki, Tetsu Tanaka, Mitsumasa Koyanagi

Proceedings of the 2014 International 3D Systems Integration Conference, 2014

2013

Effect of CVD Mn oxide layer as Cu diffusion barrier for TSV.

Mariappan Murugesan, Jichoel Bea, Kang Wook Lee, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi, Yuji Sutou, H. Wang, J. Koike

Proceedings of the 2013 IEEE International 3D Systems Integration Conference (3DIC), 2013

Impact of 3-D integration process on memory retention characteristics in thinned DRAM chip for 3-D memory.

Kang Wook Lee, Seiya Tanikawa, Mariappan Murugesan, H. Naganuma, Jichoel Bea, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi

Proceedings of the 2013 IEEE International 3D Systems Integration Conference (3DIC), 2013

3D memory chip stacking by multi-layer self-assembly technology.

Takafumi Fukushima, Jichoel Bea, Mariappan Murugesan, Ho-Young Son, M.-S. Suh, K.-Y. Byun, N.-S. Kim, Kang Wook Lee, Mitsumasa Koyanagi

Proceedings of the 2013 IEEE International 3D Systems Integration Conference (3DIC), 2013

Development of via-last 3D integration technologies using a new temporary adhesive system.

Takafumi Fukushima, Jichoel Bea, Mariappan Murugesan, Kang Wook Lee, Mitsumasa Koyanagi

Proceedings of the 2013 IEEE International 3D Systems Integration Conference (3DIC), 2013

2011

Self-Assembly of Chip-Size Components with Cavity Structures: High-Precision Alignment and Direct Bonding without Thermal Compression for Hetero Integration.

Takafumi Fukushima, Takayuki Konno, Eiji Iwata, Risato Kobayashi, Toshiya Kojima, Mariappan Murugesan, Ji Chel Bea, Kang Wook Lee, Tetsu Tanaka, Mitsumasa Koyanagi

Micromachines, 2011

High density Cu-TSVs and reliability issues.

Mariappan Murugesan, Harufumi Kobayashi, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi

Proceedings of the 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31, 2011

W/Cu TSVs for 3D-LSI with minimum thermo-mechanical stress.

Mariappan Murugesan, Hideto Hashiguchi, Harufumi Kobayashi, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi

Proceedings of the 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31, 2011

Temporary bonding strength control for self-assembly-based 3D integration.

Takafumi Fukushima, Yuki Ohara, Jichoel Bea, Mariappan Murugesan, Kang Wook Lee, Tetsu Tanaka, Mitsumasa Koyanagi

Proceedings of the 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31, 2011

2010

Impact of microbump induced stress in thinned 3D-LSIs after wafer bonding.

Mariappan Murugesan, Yuki Ohara, Jichoel Bea, Kang Wook Lee, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi

Proceedings of the IEEE International Conference on 3D System Integration, 2010

Evaluation of alignment accuracy on chip-to-wafer self-assembly and mechanism on the direct chip bonding at room temperature.

Takafumi Fukushima, Eiji Iwata, Jichoel Bea, Mariappan Murugesan, Kang Wook Lee, Tetsu Tanaka, Mitsumasa Koyanagi

Proceedings of the IEEE International Conference on 3D System Integration, 2010

2009

10 µm fine pitch Cu/Sn micro-bumps for 3-D super-chip stack.

Yuki Ohara, Akihiro Noriki, Katsuyuki Sakuma, Kang Wook Lee, Mariappan Murugesan, Jichoel Bea, Fumiaki Yamada, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi

Proceedings of the IEEE International Conference on 3D System Integration, 2009

Micro-Raman spectroscopy analysis and capacitance - time (C-t) measurement of thinned silicon substrates for 3D integration.

Ji Chel Bea, Mariappan Murugesan, Yuki Ohara, Akihiro Noriki, Hisashi Kino, Kang Wook Lee, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi

Proceedings of the IEEE International Conference on 3D System Integration, 2009