Mariam Sadaka

According to our database, Mariam Sadaka authored at least 4 papers between 2010 and 2013.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of five.

2013

Smart Stacking™ and Smart Cut™ technologies for wafer level 3D integration.

Mariam Sadaka, Ionut Radu, Chrystelle Lagahe-Blanchard, Léa Di Cioccio

Proceedings of 2013 International Conference on IC Design & Technology, 2013

2010

Pre bonding metrology solutions for 3D integration.

Gregory Riou, Gweltaz Gaudin, Didier Landru, Catherine Tempesta, Ionut Radu, Mariam Sadaka, Kevin Winstel, Emily Kinser, Robert Hannon, Boris V. Kamenev, Michael Darwin, Robert Sachs

Proceedings of the IEEE International Conference on 3D System Integration, 2010

Recent Developments of Cu-Cu non-thermo compression bonding for wafer-to-wafer 3D stacking.

Ionut Radu, Didier Landru, Gweltaz Gaudin, Gregory Riou, Catherine Tempesta, Fabrice Letertre, Léa Di Cioccio, Pierric Gueguen, Thomas Signamarcheix, C. Euvrard, Jérôme Dechamp, Laurent Clavelier, Mariam Sadaka

Proceedings of the IEEE International Conference on 3D System Integration, 2010

Low temperature direct wafer to wafer bonding for 3D integration: Direct bonding, surface preparation, wafer-to-wafer alignment.

Gweltaz Gaudin, Gregory Riou, Didier Landru, Catherine Tempesta, Ionut Radu, Mariam Sadaka, Kevin Winstel, Emily Kinser, Robert Hannon

Proceedings of the IEEE International Conference on 3D System Integration, 2010