Marc G. D. Geers

Affiliations:
  • Materials Technology Institute, Eindhoven University of Technology, Eindhoven, The Netherlands


According to our database1, Marc G. D. Geers authored at least 19 papers between 2004 and 2024.

Collaborative distances:
  • Dijkstra number2 of five.
  • Erdős number3 of five.

Timeline

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Bibliography

2024
Reduced-order modeling for second-order computational homogenization with applications to geometrically parameterized elastomeric metamaterials.
CoRR, 2024

Similarity Equivariant Graph Neural Networks for Homogenization of Metamaterials.
CoRR, 2024

2022
Correction to: A discrete element framework for the numerical analysis of particle bed-based additive manufacturing processes.
Eng. Comput., 2022

A discrete element framework for the numerical analysis of particle bed-based additive manufacturing processes.
Eng. Comput., 2022

2020
A Newton Solver for Micromorphic Computational Homogenization Enabling Multiscale Buckling Analysis of Pattern-Transforming Metamaterials.
CoRR, 2020

Level set based eXtended finite element modelling of the response of fibrous networks under hygroscopic swelling.
CoRR, 2020

Enriched continuum for multi-scale transient diffusion coupled to mechanics.
Adv. Model. Simul. Eng. Sci., 2020

2019
Influence of particle shape in the additive manufacturing process for ceramics.
Comput. Math. Appl., 2019

2018
FFT-based interface decohesion modelling by a nonlocal interphase.
Adv. Model. Simul. Eng. Sci., 2018

2017
A review of predictive nonlinear theories for multiscale modeling of heterogeneous materials.
J. Comput. Phys., 2017

2016
Three-dimensional finite element modeling of ductile crack initiation and propagation.
Adv. Model. Simul. Eng. Sci., 2016

2015
Extended modelling of dislocation transport-formulation and finite element implementation.
Adv. Model. Simul. Eng. Sci., 2015

2011
Measuring time-dependent deformations in metallic MEMS.
Microelectron. Reliab., 2011

2010
Multi-scale computational homogenization: Trends and challenges.
J. Comput. Appl. Math., 2010

2008
Characterization of semiconductor interfaces using a modified mixed mode bending apparatus.
Microelectron. Reliab., 2008

2007
Correlation between localized strain and damage in shear-loaded Pb-free solders.
Microelectron. Reliab., 2007

Cohesive zone modeling for structural integrity analysis of IC interconnects.
Microelectron. Reliab., 2007

2004
Residual stresses in microelectronics induced by thermoset packaging materials during cure.
Microelectron. Reliab., 2004

Characterization and fatigue damage simulation in SAC solder joints.
Microelectron. Reliab., 2004


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