Makoto Motoyoshi

According to our database, Makoto Motoyoshi authored at least 8 papers between 2009 and 2023.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of five.

2023

Copper Electrode Surface Features and Cu-SiO2Hybrid Bonding.

Mariappan Murugesan, M. Sawa, E. Sone, Makoto Motoyoshi, Mitsumasa Koyanagi, Takafumi Fukushima

Proceedings of the IEEE International 3D Systems Integration Conference, 2023

2021

Cu-Cu Direct Bonding Through Highly Oriented Cu Grains for 3D-LSI Applications.

Mariappan Murugesan, E. Sone, A. Simomura, Makoto Motoyoshi, M. Sawa, K. Fukuda, Mitsumasa Koyanagi, Takafumi Fukushima

Proceedings of the IEEE International 3D Systems Integration Conference, 2021

2019

3D Integrated Pixel Sensor with Silicon-on-Insulator Technology for the International Linear Collider Experiment.

Miho Yamada, Shun Ono, Yasuo Arai, Ikuo Kurachi, Toru Tsuboyama, Masayuki Ikebe, Makoto Motoyoshi

Proceedings of the 2019 International 3D Systems Integration Conference (3DIC), 2019

Stacked Pixel Sensor/Detector Technology using Au Micro-Bump Junction.

Makoto Motoyoshi, Kohki Yanagimura, Taikoh Fushimi, Shunta Endo

Proceedings of the 2019 International 3D Systems Integration Conference (3DIC), 2019

2016

Improving the integrity of Ti barrier layer in Cu-TSVs through self-formed TiSix for via-last TSV technology.

Mariappan Murugesan, Jichel Bea, Takafumi Fukushima, Makoto Motoyoshi, Tetsu Tanaka, Mitsumasa Koyanagi

Proceedings of the 2016 IEEE International 3D Systems Integration Conference, 2016

3 Dimensional stacked pixel detector and sensor technology using less than 3-μmφ robust bump junctions.

Makoto Motoyoshi, Kohki Yanagimura, Taikoh Fushimi, Junichi Takanohashi, Mariappan Murugesan, Masahiro Aoyagi, Mitsumasa Koyanagi

Proceedings of the 2016 IEEE International 3D Systems Integration Conference, 2016

2011

Stacked SOI pixel detector using versatile fine pitch μ-bump technology.

Makoto Motoyoshi, Junichi Takanohashi, Takafumi Fukushima, Yasuo Arai, Mitsumasa Koyanagi

Proceedings of the 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31, 2011

2009

Through-Silicon Via (TSV).

Makoto Motoyoshi

Proc. IEEE, 2009