Mads Brincker

According to our database, Mads Brincker authored at least 4 papers between 2015 and 2018.

Collaborative distances:

• Dijkstra number of seven.
• Erdős number of six.

2018

Low temperature transient liquid phase bonded Cu-Sn-Mo and Cu-Sn-Ag-Mo interconnects - A novel approach for hybrid metal baseplates.

Mads Brincker, Peter Kjær Kristensen, S. Söhl, R. Eisele, Vladimir N. Popok

Microelectron. Reliab., 2018

2017

Strength and reliability of low temperature transient liquid phase bonded Cu-Sn-Cu interconnects.

Mads Brincker, S. Söhl, R. Eisele, Vladimir N. Popok

Microelectron. Reliab., 2017

2016

Mechanisms of metallization degradation in high power diodes.

Mads Brincker, Peter Kjær Kristensen, Kristian Bonderup Pedersen, Vladimir N. Popok

Microelectron. Reliab., 2016

2015

Effects of thermal cycling on aluminum metallization of power diodes.

Mads Brincker, Kristian Bonderup Pedersen, Peter Kjær Kristensen, Vladimir N. Popok

Microelectron. Reliab., 2015