M. van Kleef

According to our database, M. van Kleef authored at least 2 papers between 2003 and 2007.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of five.

2007

Mechanical reliability challenges for MEMS packages: Capping.

Willem D. van Driel, Dao-Guo Yang, Cadmus A. Yuan, M. van Kleef, G. Q. (Kouchi) Zhang

Microelectron. Reliab., 2007

2003

The influence of Sn-Cu-Ni(Au) and Sn-Au intermetallic compounds on the solder joint reliability of flip chips on low temperature co-fired ceramic substrates.

N. Duan, J. Scheer, J. Bielen, M. van Kleef

Microelectron. Reliab., 2003