M. S. Abdul Aziz

According to our database, M. S. Abdul Aziz authored at least 4 papers between 2014 and 2017.

Collaborative distances:

• Dijkstra number of six.
• Erdős number of six.

2017

Experimental and numerical investigation of flow and thermal effects on flexible printed circuit board.

Chong Hooi Lim, Mohd Zulkifly Abdullah, Ishak Abdul Azid, M. S. Abdul Aziz

Microelectron. Reliab., 2017

2016

Effect of thermocapillary action in the underfill encapsulation of multi-stack ball grid array.

Fei Chong Ng, Aizat Abas, Muhammad Hafifi Hafiz Ishak, Mohd Zulkifly Abdullah, M. S. Abdul Aziz

Microelectron. Reliab., 2016

2015

Optimization of pin through hole connector in thermal fluid-structure interaction analysis of wave soldering process using response surface methodology.

M. S. Abdul Aziz, Mohd Zulkifly Abdullah, C. Y. Khor, I. A. Azid

Simul. Model. Pract. Theory, 2015

2014

Influence of solder bump arrangements on molded IC encapsulation.

C. Y. Khor, Mohd Zulkifly Abdullah, Chun-Sean Lau, W. C. Leong, M. S. Abdul Aziz

Microelectron. Reliab., 2014