M. O. Alam
According to our database1,
M. O. Alam
authored at least 9 papers
between 2002 and 2013.
Collaborative distances:
Collaborative distances:
Timeline
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Book In proceedings Article PhD thesis Dataset OtherLinks
On csauthors.net:
Bibliography
2013
Microelectron. Reliab., 2013
2012
Numerical study on thermal impacts of different void patterns on performance of chip-scale packaged power device.
Microelectron. Reliab., 2012
2011
Thermal interface materials for automotive electronic control unit: Trends, technology and R&D challenges.
Microelectron. Reliab., 2011
2004
Dynamic strength of anisotropic conductive joints in flip chip on glass and flip chip on flex packages.
Microelectron. Reliab., 2004
Adhesion strength and contact resistance of flip chip on flex packages--effect of curing degree of anisotropic conductive film.
Microelectron. Reliab., 2004
2003
Contact resistance and adhesion performance of ACF interconnections to aluminum metallization.
Microelectron. Reliab., 2003
The effect of reflow process on the contact resistance and reliability of anisotropic conductive film interconnection for flip chip on flex applications.
Microelectron. Reliab., 2003
Comparative study of the dissolution kinetics of electrolytic Ni and electroless Ni-P by the molten Sn3.5Ag0.5Cu solder alloy.
Microelectron. Reliab., 2003
2002
Microelectron. Reliab., 2002