M. Nomura

According to our database, M. Nomura authored at least 3 papers between 1981 and 2024.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of five.

2024

Integration and Characterization of High Thermal Conductivity Materials for Heat Dissipation in Stacked Devices.

W.-Y. Woon, J.-H. Jhang, K.-K. Hu, C.-C. Shih, J.-F. Hsu, J.-P. Lin, Y. Wu, Anna Kasperovich, Mohamadali Malakoutian, R. Soman, J. Kim, H.-K. Wei, M. Nomura, S. Chowdhury, Szuya Sandy Liao

Proceedings of the IEEE Symposium on VLSI Technology and Circuits 2024, 2024

High Thermal Conductivity AlN Films for Advanced 3D Chiplets.

T. Takagi, T. Ninomiya, M. Niwa, S. Obara, T. Momose, Y. Shimogaki, M. Nomura, H. Fujioka, M. Mori, T. Kuroda

Proceedings of the IEEE Symposium on VLSI Technology and Circuits 2024, 2024

1981

A study of protocol analysis for packet switched network.

K. Tsukamoto, T. Itoh, M. Nomura, Y. Tanaka

Proceedings of the seventh symposium on Data communications, 1981