M. Brizoux

According to our database, M. Brizoux authored at least 4 papers between 2006 and 2016.

Collaborative distances:

• Dijkstra number of six.
• Erdős number of five.

2016

Thermo-mechanical simulation of PCB with embedded components.

Wiyao Kpobie, Marion Martiny, Sebastien Mercier, François Lechleiter, Laurent Bodin, Aurélien Lecavelier des Etangs-Levallois, M. Brizoux

Microelectron. Reliab., 2016

2010

Thermal ageing induces drastic changes on mechanical and damage behavior of Sn3.0Ag0.5Cu alloy.

B. Dompierre, W. C. Maia Filho, M. Brizoux, Véronique Aubin, Eric Charkaluk

Microelectron. Reliab., 2010

2007

Torsion test applied for reballing and solder paste volume evaluation.

W. C. Maia Filho, M. Brizoux, Hélène Frémont, Yves Danto

Microelectron. Reliab., 2007

2006

Improved physical understanding of intermittent failure in continuous monitoring method.

W. C. Maia Filho, M. Brizoux, Hélène Frémont, Yves Danto

Microelectron. Reliab., 2006